tag: Canon

Mask/Lithography Issues For Mature Nodes
By Mark LaPedus - 22 Oct, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Jul, 2020 - Comments: 0

Fab tools, packaging/test VLSI Research has released its 200mm wafer fab equipment (WFE) market share figures for 2019. The top three suppliers--Applied Materials, TEL, and ASML—saw growth in the 2019 200mm WFE business. Lam Research was in fourth place, followed by KLA and Canon. In total, 200mm wafer fab equipment sales were $3.6 billion in 2019, declining 5% from 2018, according to the fi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Jun, 2020 - Comments: 0

Chipmakers and OEMs At next week’s Apple Worldwide Developers Conference, Apple is expected to roll out its long-awaited Arm-based Mac computers. This could provide a boost for Apple’s foundry vendor as well as equipment makers. It’s the worst-kept secret in the industry. As reported by the Apple sites, Apple is moving from Intel’s microprocessors to its own Arm-based chips for th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 May, 2020 - Comments: 0

Chipmakers and OEMs Senator Patrick Leahy (D-Vt.), Senator Chuck Schumer (D-N.Y.) and Senator Jack Reed (D-R.I.) have sent a letter to officials from the Trump administration, demanding answers about TSMC’s recent announcement to build a fab in Ariz. As reported, TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, w... » read more

Scaling CMOS Image Sensors
By Mark LaPedus - 20 Apr, 2020 - Comments: 5

After a period of record growth, the CMOS image sensor market is beginning to face some new and unforeseen challenges. CMOS image sensors provide the camera functions in smartphones and other products, but now they are facing scaling and related manufacturing issues in the fab. And like all chip products, image sensors are seeing slower growth amid the coronavirus outbreak. Manufactured a... » read more

Lithography Challenges For Fan-out
By Mark LaPedus - 12 Feb, 2019 - Comments: 3

Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools. The latest high-density fan-out packages are migrating toward the 1µm line/space barrier and beyond, which is considered a milestone in the industry. At these critical dimensions (CDs), fan-outs will provide better per... » read more

More Lithography/Mask Challenges (Part 2)
By Mark LaPedus - 17 Apr, 2018 - Comments: 3

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Regina Freed, managing director of patterning technology at [getentity id="... » read more

What Happened To Nanoimprint Litho?
By Mark LaPedus - 29 Mar, 2018 - Comments: 4

Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market. Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of markets. NIL is different than conventional lithography and resembles a stamping process. Initially, a lithographic system forms a pattern on a template based on a pre-defined design. Then, a separa... » read more

Litho Options For Panel Fan-out
By Mark LaPedus - 06 Nov, 2017 - Comments: 2

Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

Challenges For Future Fan-Outs
By Mark LaPedus - 07 Jul, 2017 - Comments: 1

The fan-out wafer-level packaging market is heating up. At the high end, for example, several packaging houses are developing new fan-out packages that could reach a new milestone and hit or break the magic 1µm line/space barrier. But the technology presents some challenges, as it may require more expensive process flows and equipment like lithography. Fig. 1: Redistribution layers. Source: L... » read more

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