tag: carbon nanotubes

EUV Mask Gaps And Issues
By Mark LaPedus - 08 May, 2019 - Comments: 1

Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and photomask technologies with Emily Gallagher, principal member of the technical staff at Imec; Harry Levinson, principal at HJL Lithography; Chris Spence, vice president of advanced technology development at ASML; Banqiu Wu, senior director of process development at Applied Materials; and Aki Fujimura, chief ... » read more

A Different Kind Of Material World
By Ed Sperling - 21 Mar, 2019 - Comments: 1

The semiconductor manufacturing world is poised for big change, and the driver will be materials. Materials always have been a critical factor in semiconductors. Silicon is so important that an entire region of California is named after it. Rare earths have raised fears about nationalistic monopolies. And the shift from aluminum to copper interconnects at 130nm caused one of the most painful... » read more

Power/Performance Bits: Nov. 13
By Jesse Allen - 13 Nov, 2018 - Comments: 0

ML identifies LED material Researchers at the University of Houston created a machine learning algorithm that can predict a material's properties to help find better host material candidates for LED lighting. One recommendation was synthesized and tested. The technique, a support vector machine regression model, was efficient enough to run on a personal computer. It scanned a list of 118,28... » read more

Carbon Nanotube DRAM
By Susan Rambo - 23 Aug, 2018 - Comments: 0

An IP design house has developed a scalable DRAM replacement using carbon nanotubes (CNTs) that abolishes the DRAM refresh rate, stores the content permanently, has better timing than DRAM and is scalable. And it lasts for somewhere between 300 and 12,000 years. “Carbon nanotube memory—it sounds so sexy that I could just shut up and not say anything,” said Bill Gervasi, principal syste... » read more

Memory Startups To Watch
By Mark LaPedus - 16 Aug, 2018 - Comments: 0

The next-generation memories are finally ramping up after years’ of delays and promises. Intel, for one, is shipping 3D XPoint, a next-generation technology based on phase-change memory. In addition, the big foundries are readying embedded MRAM. And, of course, there are a number of other players in the next-generation memory arena. There are also a number of startups that are flying un... » read more

The Growing Materials Challenge
By Katherine Derbyshire - 11 Jun, 2018 - Comments: 0

By Katherine Derbyshire & Ed Sperling Materials have emerged as a growing challenge across the semiconductor supply chain, as chips continue to scale, or as they are utilized in new devices such as sensors for AI or machine learning systems. Engineered materials are no longer optional at advanced nodes. They are now a requirement, and the amount of new material content in chips contin... » read more

System Bits: March 20
By Ann Mutschler - 20 Mar, 2018 - Comments: 0

Design has consequences Carnegie Mellon University design students are exploring ways to enhance interactions with new technologies and the power of artificial intelligence. Assistant Professor Dan Lockton teaches the course, "Environments Studio IV: Designing Environments for Social Systems" in CMU's School of Design and leads the school's new Imaginaries Lab. “We want the designers of ... » read more

Chipmakers Look To New Materials
By Jeff Dorsch - 18 Dec, 2017 - Comments: 1

Graphene, the wonder material rediscovered in 2004, and a host of other two-dimensional materials are gaining ground in manufacturing semiconductors as silicon’s usefulness begins to fade. And while there are a number of compounds in use already, such as gallium arsenide, gallium nitride, and silicon carbide, those materials generally are being confined to specific niche applications. Tran... » read more

System Bits: Oct. 24
By Ann Mutschler - 24 Oct, 2017 - Comments: 0

Optical communication on silicon chips With the huge increase in computing performance in recent decades achieved by squeezing ever more transistors into a tighter space on microchips, at the same time this downsizing has also meant packing the wiring within microprocessors ever more tightly together. This has led to effects such as signal leakage between components, which can slow down commun... » read more

Exploring New Scaling Approaches
By Mark LaPedus - 19 Oct, 2017 - Comments: 0

At the recent SPIE Photomask Technology + Extreme Ultraviolet Lithography 2017 conference, Semiconductor Engineering sat down to discuss semiconductor technology with Tsu-Jae King Liu, the TSMC Distinguished Professor in Microelectronics in the Department of Electrical Engineering and Computer Sciences at the University of California at Berkeley. More specifically, Liu discussed some of the new... » read more

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