tag: CEA-Leti

Manufacturing Bits: March 15
By Mark LaPedus - 15 Mar, 2016 - Comments: 0

More multi-beam The multi-beam e-beam market is a hot topic. For example, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications. Meanwhile, at the recent SPIE Advanced Lithography conference, Mapper Lithography disclosed new upgrades for its multi-beam e-beam tool for use in direct-write lithography application... » read more

Manufacturing Bits: March 8
By Mark LaPedus - 08 Mar, 2016 - Comments: 1

5G mmWave consortium Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. Carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Radio-frequency (RF... » read more

Internet of FD-SOI Things?
By Katherine Derbyshire - 18 Feb, 2016 - Comments: 0

Are fully-depleted silicon-on-insulator (FD-SOI) wafers having a moment? Certainly SOI wafers are not new. Soitec’s SmartCut layer transfer technology was patented in 1994, and wafers with implanted oxide layers were available before that. Still, adoption of SOI wafers has been limited. Though they offer improved device isolation and reduced parasitics, the increased wafer cost has been an ob... » read more

Manufacturing Bits: Feb. 9
By Mark LaPedus - 09 Feb, 2016 - Comments: 1

3D chip consortium The 3D integration consortium of IRT Nanoelec has a new member--EV Group. Based in Grenoble, France, IRT Nanoelec is an R&D center headed by CEA-Leti. Formed in 2012, the 3D integration consortium is one of IRT’s core programs. EV Group joins Leti, Mentor Graphics, SET and STMicroelectronics as members of the 3D consortium. The program is developing a 3D integration ... » read more

Power/Performance Bits: Feb. 2
By Jesse Allen - 02 Feb, 2016 - Comments: 0

Single electron transistors A group coordinated by the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) is setting out on a four year program to develop single electron transistors fully compatible with CMOS technology and capable of room temperature operation. The single electron transistor (SET) switches electricity by means of a single electron. The SET is based on a quantum dot (consisting... » read more

Neuromorphic Chip Biz Heats Up
By Mark LaPedus - 21 Jan, 2016 - Comments: 0

It’s no secret that today’s computers are struggling to keep up with the enormous demands of data processing and bandwidth, and the whole electronics industry is searching for new ways to enable that. The traditional approach is to continue to push the limits of today’s systems and chips. Another way is to go down the non-traditional route, including an old idea that is generating stea... » read more

Manufacturing Bits: Jan. 19
By Mark LaPedus - 19 Jan, 2016 - Comments: 0

Bubble-pen lithography The University of Texas at Austin has developed a new nano-patterning technology--bubble-pen lithography. Researchers have devised a bubble-pen that enables optically-controlled microbubbles. The bubbles are used to pattern structures onto a surface at tiny dimensions. Bubble-pen lithography could be used in microelectronics, nanophotonics, and nanomedicine. In si... » read more

Manufacturing Bits: Dec. 8
By Mark LaPedus - 08 Dec, 2015 - Comments: 0

Quantum computing At this week’s IEEE International Electron Devices Meeting (IEDM) in Washington, D.C., chipmakers, research institutes and universities presented a plethora of papers on several subjects. A large number of papers revolve around the same theme—How to extend Moore’s Law. For this, researchers are working on a number of short- and long-term technologies to propel device... » read more

Manufacturing Bits: Dec. 1
By Mark LaPedus - 01 Dec, 2015 - Comments: 0

European R&D hub A new European hub for semiconductor R&D is open for business. The hub is part of an EU-funded program called ASCENT or Access to European Nanoelectronics Network. The program is aimed to give researchers access to chip and related technologies within three European R&D organizations--CEA-Leti, Imec and the Tyndall National Institute. As reported, ASCENT was originally f... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Oct, 2015 - Comments: 0

Is the sky falling in the IC equipment market? Not yet, but watch out below. Semi capital spending is expected to reach $60.37 billion in 2015, down 1% from 2014, according to Pacific Crest Securities. “Although we trimmed 2016 capex three weeks ago, we are trimming some more. We now see semiconductor capex down 4% in 2016. However, we do not see capex falling off a cliff in 2016 (i.e., down ... » read more

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