tag: CEA-Leti

Manufacturing Bits: Sept. 23
By Mark LaPedus - 23 Sep, 2014 - Comments: 0

The annual IEEE International Electron Devices Meeting (IEDM) will take place in San Francisco from Dec. 15-17. As usual, there will be presentations on the latest technologies in a number of fields, such as semiconductors, bio‐sensors, energy harvesting, power devices, sensors, magnetics, spintronics, two-dimensional electronics, among others. Here’s just some of the papers that will be pr... » read more

What Happened To Next-Gen Lithography?
By Mark LaPedus - 03 Sep, 2014 - Comments: 2

Chipmakers continue to march down the process technology curve. Using today’s optical lithography and multiple patterning, the semiconductor industry is scaling its leading-edge devices far beyond what was once considered possible. The question is how far can the industry extend 193nm immersion [getkc id="80" comment="lithography"] and multiple patterning before these technologies become t... » read more

Manufacturing Bits: Sept. 2
By Mark LaPedus - 02 Sep, 2014 - Comments: 0

Looking at space dust The first analysis of space dust, collected by a special collector onboard NASA's Stardust mission and sent back to Earth for study in 2006, is more complex in composition and structure than previously thought. Researchers examined the dust using synchrotron light sources from three groups--the U.S. Department of Energy's Argonne National Laboratory, Lawrence Berkeley... » read more

Manufacturing Bits: July 15
By Mark LaPedus - 15 Jul, 2014 - Comments: 0

Multi-beam hits milestone Mapper Lithography has reached a major milestone in its ongoing push to bring multi-beam, direct-write lithography into the mainstream. The Dutch-based company recently installed its initial pre-production tool at CEA-Leti, a French-based R&D organization. The tool, dubbed Matrix 1.1, is a multi-beam, e-beam system for direct-write applications. During the r... » read more

What Comes Next?
By SEMI - 27 Jun, 2014 - Comments: 0

The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014 (www.semiconwest.org), to be held on July 8-10 at the Moscone Center in San Francisco, Calif. The co-location of emerging and adjacent market focused exhibitors and technical presentations within the framework of SEMICON West maximizes the synergies between sem... » read more

Manufacturing Bits: May 20
By Mark LaPedus - 20 May, 2014 - Comments: 0

Brain chips Pennsylvania State University has developed a technology that could enable futuristic biochips, namely those that mimic the human brain. In the lab, Penn State combined a thin film of vanadium dioxide (VO2) on a titanium dioxide substrate to create an oscillating switch. VO2 is an exotic material that exhibits semiconductor-to-metal transitions at 68 °C. In the R&D stage fo... » read more

SEMICON West Preview
By SEMI - 19 May, 2014 - Comments: 0

By Paula Doe The fast growing demand for bandwidth is driving telecomm and data center user interest in moving high speed optical connections closer and closer to the chips, as recent advances in packaging technology, from microbumping to bonding to wafer-level redistribution now help make it possible. Chip-to-chip and chip-to-board optical connections increasingly look like a viable soluti... » read more

Billions And Billions Invested
By Mark LaPedus - 17 Apr, 2014 - Comments: 4

Over the years, next-generation [getkc id="80" kc_name="lithography"] (NGL) has suffered various setbacks and delays. But until recently, the industry basically shrugged its shoulders and expressed relatively little anxiety about the NGL delays. After all, optical lithography was doing the job in the fab and NGL would eventually materialize. Today, however, the mood is different. In fact, th... » read more

Directed Self-Assembly Gains Momentum
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

At last year’s SPIE Advanced Lithography symposium, directed self-assembly (DSA) grabbed the spotlight as chipmakers provided the first glimpse of their initial work and results with the technology. The results were stunning, thereby propelling DSA from a curiosity item to a possible patterning solution for next-generation devices. Last year, in fact, GlobalFoundries, IBM, Intel and Sams... » read more

Under The Radar At SPIE
By Mark LaPedus - 20 Mar, 2014 - Comments: 2

At the SPIE Advanced Lithography symposium, the best and brightest minds in the lithography, metrology, resist and design-for-manufacturing (DFM) fields assemble for a week. The annual event is a good way to get a pulse on the current state of lithography. At this year’s SPIE, it was simple to get a reading. Extreme ultraviolet (EUV) lithography remains delayed. The other next-generation l... » read more

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