Chip Industry Week In Review


By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Week In Review: Semiconductor Manufacturing, Test


Restrictions on China continue to grow. The Biden Administration is considering more restrictions on selling advanced AI chips to China, according to multiple media reports. Meanwhile, the Dutch government is expected to limit the sale of manufacturing equipment. JIC Capital, the wholly owned subsidiary of Japan Investment Corporation (JIC), will purchase materials company JSR Corp. through ... » read more

Week In Review: Design, Low Power


Keysight Technologies said it intends to acquire ESI Group for €913 million (~$998.6 million). ESI Group provides virtual prototyping solutions for the automotive and aerospace end markets that can create real-time digital twins to simulate a product's behavior during testing and real-life use. MLCommons announced the latest results from two MLPerf benchmark suites. One aims to measure the... » read more

Research Bits: May 16


Germanium-tin transistor Scientists at Forschungszentrum Jülich, CEA-Leti, University of Leeds, Leibniz Institute for High Performance Microelectronics, and RWTH Aachen University fabricated a new type of transistor from a germanium-tin alloy. Charge carriers can move faster in the material than in silicon or germanium, which enables lower voltages in operation. “The germanium–tin syst... » read more

Chip Industry’s Technical Paper Roundup: May 16


New technical papers recently added to Semiconductor Engineering’s library: [table id=103 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Recent Developments in Neuromorphic Computing, Focusing on Hardware Design and Reliability


A new technical paper titled "Special Session: Neuromorphic hardware design and reliability from traditional CMOS to emerging technologies" was published by researchers at Univ. Lyon, Ecole Centrale de Lyon, Univ. Grenoble Alpes, Hewlett Packard Labs, CEA-LETI, and Politecnico di Torino. Abstract "The field of neuromorphic computing has been rapidly evolving in recent years, with an incre... » read more

Chip Industry’s Technical Paper Roundup: Apr. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=90 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Neuromorphic Computing: Self-Adapting HW With ReRAMs


A new technical paper titled "A self-adaptive hardware with resistive switching synapses for experience-based neurocomputing" was published by researchers at Infineon Technologies, Politecnico di Milano and IUNET, Weebit Nano, and CEA Leti. Abstract "Neurobiological systems continually interact with the surrounding environment to refine their behaviour toward the best possible reward. Achie... » read more

Week In Review: Design, Low Power


The UK government published its National Quantum Strategy, which outlines the plan to invest £2.5 billion (~$3.0 billion) over the next 10 years into quantum technology, including computing, sensing, timing, imaging, and networking. "We will develop UK strengths across different hardware platforms, software, and components, and reinforce our capabilities throughout the supply chains. Although ... » read more

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing


Published by the eBeam Initiative Member Companies (February 2023), this list of artificial intelligence (AI) systems used by member companies in their semiconductor manufacturing products shows progress. New examples of systems using AI include: image processing and parameter tuning in lithography tool mask metrology system B-SPline Control Point generation tool sem... » read more

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