tag: CEA-Leti

Benchmarking Electron Holography And Pixelated STEM On Various Semiconductor Structures
By Technical Paper Link - 06 Feb, 2024 - Comments: 0

A technical paper titled “Measuring electrical properties in semiconductor devices by pixelated STEM and off-axis electron holography (or convergent beams vs. plane waves).” was published by researchers at CEA-LETI at the Universite Grenoble Alpes and EPFL. Abstract: "We demonstrate the use of both pixelated differential phase contrast (DPC) scanning transmission electron microscopy (STEM... » read more

Research Bits: Jan. 23
By Jesse Allen - 23 Jan, 2024 - Comments: 0

Memristor-based Bayesian neural network Researchers from CEA-Leti, CEA-List, and CNRS built a complete memristor-based Bayesian neural network implementation for classifying types of arrhythmia recordings with precise aleatoric and epistemic uncertainty. While Bayesian neural networks are useful for at sensory processing applications based on a small amount of noisy input data because they ... » read more

Chip Industry Technical Paper Roundup: Jan. 23
By Liz Allan - 23 Jan, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=189 /] More ReadingTechnical Paper Library home » read more

3D Integration Supports CIM Versatility And Accuracy
By Katherine Derbyshire - 18 Jan, 2024 - Comments: 0

Compute-in-memory (CIM) is gaining attention due to its efficiency in limiting the movement of massive volumes of data, but it's not perfect. CIM modules can help reduce the cost of computation for AI workloads, and they can learn from the highly efficient approaches taken by biological brains. When it comes to versatility, scalability, and accuracy, however, significant tradeoffs are requir... » read more

Novel Neuromorphic Artificial Neural Network Circuit Architecture
By Technical Paper Link - 15 Jan, 2024 - Comments: 0

A technical paper titled “Mosaic: in-memory computing and routing for small-world spike-based neuromorphic systems” was published by researchers at CEA-LETI Université Grenoble Alpes, University of Zurich and ETH Zurich. Abstract: "The brain’s connectivity is locally dense and globally sparse, forming a small-world graph—a principle prevalent in the evolution of various species, sugg... » read more

Money Pours Into New Fabs And Facilities
By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Chip Industry Week In Review
By The SE Staff - 22 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan More than 1 billion generative AI smartphones are expected be shipped during 2024 to 2027, reports Counterpoint. The share of GenAI smartphones will be 4% of the market in 2023 and is likely to double in 2024, with Samsung capturing half the market, followed by Chinese OEMs. By 2027, GenAI smartphones could account for 40% of the market. Global ... » read more

Modeling Compute In Memory With Biological Efficiency
By Katherine Derbyshire - 19 Dec, 2023 - Comments: 0

The growing popularity of generative AI, which uses natural language to help users make sense of unstructured data, is forcing sweeping changes in how compute resources are designed and deployed. In a panel discussion on artificial intelligence at last week’s IEEE Electron Device Meeting, IBM’s Nicole Saulnier described it as a major breakthrough that should allow AI tools to assist huma... » read more

Chip Industry Week In Review
By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Week In Review: Semiconductor Manufacturing, Test
By SE Staff - 30 Jun, 2023 - Comments: 0

Restrictions on China continue to grow. The Biden Administration is considering more restrictions on selling advanced AI chips to China, according to multiple media reports. Meanwhile, the Dutch government is expected to limit the sale of manufacturing equipment. JIC Capital, the wholly owned subsidiary of Japan Investment Corporation (JIC), will purchase materials company JSR Corp. through ... » read more

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