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Progress And Challenges On The CFD Vision 2030 Roadmap


After a long writing (and longer editing and approval seeking) process, the AIAA's CFD Vision 2030 Integration Committee has published its first update to the Vision's roadmap. This 71 page, thoroughly cited report assesses progress toward the Vision during 2020 and also provides a 5-year look-back. It covers the six domains along which the vision assesses progress in CFD: high performance comp... » read more

Fluid Dynamics Of Sonic Booms From Supersonic Aircraft


The return to supersonic flight is amongst the hottest topics in aviation today, as several companies (Boom Supersonic and Aerion, among others) are actively developing new supersonic commercial airliners targeted to enter in service in the coming years. In this context, a quiet flight over land is one of the major challenges to ensure the regulatory compliance of such airliners. Several resea... » read more

Mapping Heat Across A System


Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

Achieving Physical Reliability Of Electronics With Digital Design


By John Parry and G.A. (Wendy) Luiten With today’s powerful computational resources, digital design is increasingly used earlier in the design cycle to predict zero-hour nominal performance and to assess reliability. The methodology presented in this article uses a combination of simulation and testing to assess design performance, providing more reliability and increased productivity. ... » read more

Simulating The Hyperloop


When SpaceX held the first Hyperloop Design Weekend Competition in Texas in January 2016, a team of five students from the Universitat Politècnica de València (UPV) in Spain, calling themselves Hyperloop UPV, won awards for Best Overall Concept Design and Best Propulsion System. The overall concept was to use magnetic levitation to give their Hyperloop vehicle a frictionless ride through t... » read more

Speeding Up Electrical Vehicle Development With Designer-Centric Thermal And Electromagnetic Simulation And Analysis


By 2040, 54% of new car sales and 33% of the global car fleet is predicted to be electric [1]. More than six countries have announced a ban on internal-combustion engines. China is expected to be the largest market for electrical vehicles (EVs), which is driving automakers to make aggressive rollout plans for EVs. Some of the important trends driving EV development are getting more than 200 ... » read more

Heatsinks Here, There, Everywhere!


Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. A heatsink makes heat spread out, so that it passes to the air over a much larger surface area than it would otherwise. Air then carries the heat away, cooling the electronics that generated it. So, why not place a heatsink on top of any thermally critical component? To read more, click here. » read more

HPC Case Study: CFD Applications On ARM


In this paper, we examine the readiness and potential of ARM-based platforms for High Performance Computing, and have benchmarked two different computational fluid dynamics (CFD) applications. CFD represents one of the most widely used HPC applications in aerospace, automotive and other engineering areas such as turbine-design. For server hardware, we leverage the ThunderX platform from Cavium,... » read more

How To Use CFD To Test And Analyze A Chip Package


By Prasad Tota and Robert Day Throughout the electronics industry, submicron feature size at the die level are driving package component sizes down to the design-rule level of the early technologies. Today’s integrated circuit (IC) package technology must deliver higher lead counts, reduced lead pitch, minimum footprint area, and significant volume reduction, which has led to semiconductor... » read more

1D-3D CFD And 3D-1D CFD: Simulation Based Characterization


To understand 1D-3D CFD and 3D-1D CFD, we have reviewed the history of attempts at both loose and close coupling of 1D and 3D CFD codes, the motivations of engineers who did it, and the benefits to be gained from these complementary engineering simulation technologies. Not least, because the umbrella term ‘1D/3D’ covers a number of different possible implementations with their own pros and ... » read more

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