Week In Review: Design, Low Power


Intel acquired vision and video FPGA IP company Omnitek. Founded in 1998, the Basingstoke, England-based company has produced FPGA IP cores for video processing including conversion and enhancement, creating arbitrary image warps on a real time video stream, connectivity, and deep learning and AI inferencing. Terms of the deal were not disclosed. Qualcomm and Apple have dropped all litigatio... » read more

Blog Review: April 17


In a video, Mentor's Colin Walls digs into power management in embedded software with a particular look at the Power Pyramid model. Synopsys' Taylor Armerding checks out the state of application security at this year's RSA and finds that while organizations are paying attention to security through training and dedicated teams, roadblocks still remain. Cadence's Paul McLellan considers how... » read more

Target: 50% Reduction In Memory Power


Memory consumes about 50% or more of the area and about 50% of the power of an SoC, and those percentages are likely to increase. The problem is that static random access memory (SRAM) has not scaled in accordance with Moore's Law, and that will not change. In addition, with many devices not chasing the latest node and with power becoming an increasing concern, the industry must find ways to... » read more

From AI Algorithm To Implementation


Semiconductor Engineering sat down to discuss the role that EDA has in automating artificial intelligence and machine learning with Doug Letcher, president and CEO of Metrics; Daniel Hansson, CEO of Verifyter; Harry Foster, chief scientist verification for Mentor, a Siemens Business; Larry Melling, product management director for Cadence; Manish Pandey, Synopsys fellow; and Raik Brinkmann, CEO ... » read more

Blog Review: April 3


Synopsys' Taylor Armerding contends that as the IoT becomes more ubiquitous, the threat of cyber-physical attacks is rising, with the potential for a domino effect if even simple devices are compromised in large enough quantities. Mentor's Colin Walls considers the move away from programming on bare metal with the rise of drivers and RTOSes and when it makes sense to still use the old method... » read more

Heterogeneous Design Creating Havoc With Firmware Versions


Adding different kinds of processing elements into chips is creating system-level incompatibilities because of sometimes necessary, but usually uncoordinated, firmware updates from multiple vendors. In the past, firmware typically was synchronized with other firmware and the chip was verified and debugged. But this becomes much more difficult when multiple heterogeneous processing elements a... » read more

Week In Review: Design, Low Power


Synopsys announced several new products: a new test family, a physical verification solution, and a software library for neural net SoCs. TestMAX, the new family of test products, includes soft error analysis and X-tolerant logic BIST for automotive test and functional safety requirements. TestMAX enables test through functional high-speed interfaces and supports early validation of DFT logi... » read more

The Growing Challenge Of Thermal Guard-Banding


Guard-banding for heat is becoming more difficult as chips are used across a variety of new and existing applications, forcing chipmakers to architect their way through increasingly complex interactions. Chips are designed to operate at certain temperatures, and it is common practice to develop designs with some margin to ensure correct functionality and performance throughout the operat... » read more

Week In Review: Design, Low Power


Cadence debuted Denali Gen2 IP for LPDDR5/4/4X in TSMC's 7nm FinFET process technology. The offering consists of PHY, controller and Verification IP. It supports both the pre-release LPDDR5 standard and LPDDR4/4X devices as well as Arm AMBA AXI buses and reliability features like in-line error correcting codes. The LPDDR5 standard provides up to 1.5x bandwidth over LPDDR4 and LPDDR4X. The US... » read more

New Design Approaches At 7/5nm


The race to build chips with a multitude of different processing elements and memories is making it more difficult to design, verify and test these devices, particularly when AI and leading-edge manufacturing processes are involved. There are two fundamental problems. First, there are much tighter tolerances for all of the components in those designs due to proximity effects. Second, as a re... » read more

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