tag: chiplets

New AI Processors Architectures Balance Speed With Efficiency
By Ed Sperling - 04 Sep, 2024 - Comments: 1

Leading AI systems designs are migrating away from building the fastest AI processor possible, adopting a more balanced approach that involves highly specialized, heterogeneous compute elements, faster data movement, and significantly lower power. Part of this shift revolves around the adoption of chiplets in 2.5D/3.5D packages, which enable greater customization for different workloads and ... » read more

A New Generation Of 7400 Socket
By Brian Bailey - 29 Aug, 2024 - Comments: 0

When I was 18, and just been accepted at Brunel University in West London to start my undergraduate degree in electrical and electronic engineering, I sent off a letter to Texas Instruments telling them about the journey ahead of me and asked if they could they send me a copy of their TTL Data Book. A few weeks later a package arrived and there it was. This incredible brown/orange book, thicker... » read more

Defining The Chiplet Socket
By Brian Bailey - 29 Aug, 2024 - Comments: 0

Experts At The Table: The semiconductor industry has been buzzing with the possibilities surrounding chiplets, but so far this packaging technology has been confined to large semiconductor companies that are vertically integrated. The industry has been attempting to open this up to a broader group of people. To work out what this means for chiplets, and what standardization will be required, Se... » read more

Chiplets and the Early Adopter’s Dilemma
By Eliyan - 28 Aug, 2024 - Comments: 0

Early adopters of a new technology often face a serious dilemma. On one hand, moving early means exploiting the most aggressive new technology available. But on the other hand, making early technology decisions can lock a product line into a path that will later become uncompetitive—either a single-vendor solution that can’t guarantee continuity of supply, or a roadmap that can’t shift an... » read more

3.5D: The Great Compromise
By Ed Sperling - 21 Aug, 2024 - Comments: 1

The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. This assembly model satisfies the need for big increases in performance while sidestepping some of the thorniest issues in heterogeneous integration. It establishes a midd... » read more

Joint Interdisciplinary Work To Enable Novel, Industry-Ready Chiplet Solutions
By Fraunhofer IIS/EAS - 07 Aug, 2024 - Comments: 0

Fraunhofer is going to establish the Chiplet Center of Excellence (CCoE), which is a unique research activity based on Fraunhofer‘s long experience and broad research portfolio in design, implementation and test of 2.5 and 3D integrated electronic systems. The Center aims at establishing a common understanding among the partners and at creating a suitable chiplet development methodology. This... » read more

Metrology And Inspection For The Chiplet Era
By Gregory Haley - 06 Aug, 2024 - Comments: 0

New developments and innovations in metrology and inspection will enable chipmakers to identify and address defects faster and with greater accuracy than ever before, all of which will be required at future process nodes and in densely packed assemblies of chiplets. These advances will affect both front-end and back-end processes, providing increased precision and efficiency, combined with a... » read more

Leveraging AI To Efficiently Test AI Chips
By Ira Leventhal - 06 Aug, 2024 - Comments: 0

In the fast-paced world of technology, where innovation and efficiency are paramount, integrating artificial intelligence (AI) and machine learning (ML) into the semiconductor testing ecosystem has become of critical importance due to ongoing challenges with accuracy and reliability. AI and ML algorithms are used to identify patterns and anomalies that might not be discovered by human testers o... » read more

Keeping Up With New ADAS And IVI SoC Trends
By Hezi Saar - 01 Aug, 2024 - Comments: 0

In the automotive industry, AI-enabled automotive devices and systems are dramatically transforming the way SoCs are designed, making high-quality and reliable die-to-die and chip-to-chip connectivity non-negotiable. This article explains how interface IP for die-to-die connectivity, display, and storage can support new developments in automotive SoCs for the most advanced innovations such as c... » read more

Making Electronics More Efficient
By Ed Sperling - 31 Jul, 2024 - Comments: 0

Projections about the amount of energy required for AI in data centers and other electronic devices are putting a spotlight on more efficient electronics. But making chips and systems more efficient is an enormous challenge. It used to be as simple as turning down the voltage or moving to the next process node, but those approaches are no longer yielding the same kinds of benefits as in the pas... » read more

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