Americas Chip Funding Energizes Industry

By Liz Allan - 23 Oct, 2024 - Comments: 0

This is the second in a series of articles tracking government chip investments. See part one here (global), part 3 covering EMEA is here and Asia here. Since the first announcement of a non-binding preliminary memorandum of terms with BAE Systems in December 2023, the U.S. Department of Commerce has rolled out comprehensive plans to support more than a dozen companies in order to shore up... » read more

Chip Industry Week In Review

By The SE Staff - 12 Jul, 2024 - Comments: 0

The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Chip Industry’s Technical Paper Roundup: Jan. 17

By Linda Christensen - 17 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library. [table id=74 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting li... » read more

Arbitrary Precision DNN Accelerator Controlled by a RISC-V CPU (Ecole Polytechnique Montreal, IBM, Mila, CMC)

By Technical Paper Link - 10 Jan, 2023 - Comments: 1

A new technical paper titled "BARVINN: Arbitrary Precision DNN Accelerator Controlled by a RISC-V CPU" was written by researchers at Ecole Polytechnique Montreal, IBM, Mila and CMC Microsystems. It was accepted for publication in the 2023, 28th Asia and South Pacific Design Automation Conference (ASP-DAC 2023) in Japan. Abstract: "We present a DNN accelerator that allows inference at arbitr... » read more

Week In Review: Design, Low Power

By Jesse Allen - 12 Mar, 2021 - Comments: 0

Tools & IP Codasip unveiled three commercially licensed add-ons to the Western Digital SweRV Core EH1, aiming to allow it to be designed into a wider range of applications. The SweRV Core EH1 is a 32-bit, dual-issue, RISC-V ISA core with a 9-stage pipeline, open-sourced through CHIPS Alliance. The add-ons offer a floating-point unit (FPU) that supports the RISC-V single precision [F] and d... » read more

Week In Review: Design, Low Power

By Jesse Allen - 07 Jun, 2019 - Comments: 0

M&A Infineon Technologies will acquire Cypress Semiconductor for $23.85 per share in cash, or $10.1 billion. The deal will place Infineon as the number eight chip manufacturer in the world based on 2018 revenues and create an automotive powerhouse, making the combined company the largest supplier of chips to the automotive market. Infineon sees potential to reach into new industrial and co... » read more

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tag: CMC Microsystems

Americas Chip Funding Energizes Industry

Chip Industry Week In Review

Chip Industry’s Technical Paper Roundup: Jan. 17

Arbitrary Precision DNN Accelerator Controlled by a RISC-V CPU (Ecole Polytechnique Montreal, IBM, Mila, CMC)

Week In Review: Design, Low Power

Week In Review: Design, Low Power

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