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Chip Industry’s Technical Paper Roundup: Jan. 17


New technical papers added to Semiconductor Engineering’s library. [table id=74 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting li... » read more

Arbitrary Precision DNN Accelerator Controlled by a RISC-V CPU (Ecole Polytechnique Montreal, IBM, Mila, CMC)


A new technical paper titled "BARVINN: Arbitrary Precision DNN Accelerator Controlled by a RISC-V CPU" was written by researchers at Ecole Polytechnique Montreal, IBM, Mila and CMC Microsystems. It was accepted for publication in the 2023, 28th Asia and South Pacific Design Automation Conference (ASP-DAC 2023) in Japan. Abstract: "We present a DNN accelerator that allows inference at arbitr... » read more

Week In Review: Design, Low Power


Tools & IP Codasip unveiled three commercially licensed add-ons to the Western Digital SweRV Core EH1, aiming to allow it to be designed into a wider range of applications. The SweRV Core EH1 is a 32-bit, dual-issue, RISC-V ISA core with a 9-stage pipeline, open-sourced through CHIPS Alliance. The add-ons offer a floating-point unit (FPU) that supports the RISC-V single precision [F] and d... » read more

Week In Review: Design, Low Power


M&A Infineon Technologies will acquire Cypress Semiconductor for $23.85 per share in cash, or $10.1 billion. The deal will place Infineon as the number eight chip manufacturer in the world based on 2018 revenues and create an automotive powerhouse, making the combined company the largest supplier of chips to the automotive market. Infineon sees potential to reach into new industrial and co... » read more