The Week in Review: IoT

By Jeff Dorsch - 08 Jul, 2016 - Comments: 0

Networks The Netherlands and South Korea are both laying claim to installing the first nationwide Internet of Things networks in the world. In the Netherlands, KPN has connected the country with a low-power, wide-area network optimized for IoT. SK Telecom is serving Korea with coast-to-coast IoT coverage, and the Korean carrier plans to spend up to $86.8 million through the end of 2017 on upg... » read more

The Week In Review: Design/IoT

By Jesse Allen - 09 Oct, 2015 - Comments: 0

Imec and Cadence completed the first tapeout of a 5nm test chip. Using a processor design, the companies taped out a set of designs using EUV lithography as well as Self-Aligned Quadruple Patterning for 193i lithography, where metal pitches were scaled from the nominal 32nm pitch down to 24nm to push the limit of patterning. Tools Synopsys folded in recent acquisition Atrenta's testabilit... » read more

The Week In Review: Design/IoT

By Ed Sperling - 09 Jan, 2015 - Comments: 0

IP Cadence rolled out a fourth-generation audio/voice DSP core for 32-bit DTS-X audio/voice processing, using multi-channel object-based audio. The technology allows for more textured 3D sound, while simplifying the steps for creating sound channels. Chips NXP rolled out a one-chip solution for smart car access, which combines passive keyless entry, an RF transmitter and an immobilizer. Th... » read more

The Week In Review: Design/IoT

By Ed Sperling - 21 Nov, 2014 - Comments: 0

IoT The first test drive to showcase intelligent traffic was held in Europe this week. NXP, Siemens, Honda, Cohda Wireless, TÜV Süd, and Automobile Clubs AvD and ANWB are all working within the Intelligent Transport Systems Corridor that runs between Austria, German and the Netherlands. IP Open-Silicon rolled out memory controller IP for the Hybrid Memory Cube 2.0 standard. The 3D stacke... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Cohda Wireless

The Week in Review: IoT

The Week In Review: Design/IoT

The Week In Review: Design/IoT

The Week In Review: Design/IoT