Thermal Management Implications For Heterogeneous Integrated Packaging

By Cameron Nelson - 17 Feb, 2022 - Comments: 1

As the semiconductor industry reaches lower process nodes, silicon designers struggle to have Moore's Law produce the results achieved in earlier generations. Increasing the die size in a monolithic system on chip (SoC) designs is no longer economically viable. The breakdown of monolithic SoCs into specialized chips, referred to as chiplets, presents significant benefits in terms of cost, yield... » read more

Power/Performance Bits: Feb. 8

By Jesse Allen - 08 Feb, 2021 - Comments: 0

Transparent sensor Researchers at Osaka University created a thin, flexible, transparent sensor using silver nanowire networks. High-resolution printing was used to fabricate the centimeter-scale cross-aligned silver nanowire arrays, with reproducible feature sizes from 20 to 250 micrometers. As a proof-of-concept for functionality, they used their arrays to detect electrophysiological signals... » read more

Power/Performance Bits: Nov. 9

By Jesse Allen - 09 Nov, 2020 - Comments: 0

Integrated transistor cooling Researchers at Ecole Polytechnique Fédérale de Lausanne (EPFL) created a single chip that combines a transistor and microfluidic cooling system for more efficient transistor heat management. The team focused on a co-design approach for the electrical and mechanical aspects of the chip, bringing the electronics and cooling design together and aiming to extract... » read more

Power Issues Grow For Cloud Chips

By Ann Mutschler - 11 Oct, 2018 - Comments: 0

Performance levels in traditional or hyperscale data centers are being limited by power and heat caused by an increasing number of processors, memory, disk and operating systems within servers. The problem is so complex and intertwined, though, that solving it requires a series of steps that hopefully add up to a significant reduction across a system. But at 7nm and below, predicting exactly... » read more

Power/Performance Bits: March 21

By Jesse Allen - 21 Mar, 2017 - Comments: 0

Tiny redox flow batteries for chips Researchers at ETH Zurich and IBM Research Zurich built a tiny redox flow battery capable of both powering and cooling stacks of chips. In a flow battery, an electrochemical reaction is used to produce electricity out of two liquid electrolytes, which are pumped to the battery cell from outside via a closed electrolyte loop. Such batteries are usually u... » read more

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Knowledge Centers
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tag: cooling

Thermal Management Implications For Heterogeneous Integrated Packaging

Power/Performance Bits: Feb. 8

Power/Performance Bits: Nov. 9

Power Issues Grow For Cloud Chips

Power/Performance Bits: March 21