Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 06 Jan, 2023 - Comments: 0

TSMC is in advanced talks with key suppliers about setting up its first potential European plant in Dresden, Germany, according to Nikkei Asia. The company held a 3nm volume production and capacity expansion ceremony at its Fab 18. TSMC also is building 3nm capacity at its Arizona site, as well as opening a global R&D Center in the Hsinchu Science Park in the second quarter of 2023, to be ... » read more

Technical Paper Round-Up: April 19

By Linda Christensen - 19 Apr, 2022 - Comments: 0

New technical papers include selective etching, ISO 26262 test bench, hardware accelerators, RISC-V, lidar, EUV mask inspection, fault attacks, edge computing, gallium oxide, and machine learning for VLSI CAD-on-chip power grid design. Cutting-edge research is now a global effort. It extends from the U.S. Air Force, to schools such as MIT, and universities in Italy, Spain, Portugal, India, K... » read more

Manufacturing Bits: March 16

By Mark LaPedus - 16 Mar, 2021 - Comments: 0

Tripping up neural networks For years, Russia has been an active area in R&D. In one example, Russia's Skolkovo Institute of Science and Technology (Skoltech) has demonstrated how certain patterns can cause neural networks to make mistakes in recognizing images. Leveraging the theory behind this research, Skoltech can design defenses for pattern recognition systems that are vulnerable t... » read more

Manufacturing Bits: Sept. 29

By Mark LaPedus - 29 Sep, 2020 - Comments: 0

Exploring chemical reactions using EUV The University of Tokyo has established a facility to study fast chemical reactions using a coherent extreme ultraviolet light source. The new coherent extreme ultraviolet (XUV) source facility enables researchers to explore time-dependent phenomena, such as ultrafast chemical reactions of biological or physical samples. Located in an underground fa... » read more

Manufacturing Bits: Sept. 25

By Mark LaPedus - 25 Sep, 2018 - Comments: 0

Simulating quarks and gluons The U.S. Department of Energy’s Oak Ridge National Laboratory is simulating sub-atomic particles on the world’s most powerful supercomputer. The system is simulating these particles at speeds over 70 times faster than the predecessor. More specifically, Oak Ridge is simulating quarks and gluons on the recently-announced Summit supercomputer. In simple terms,... » read more

EUV’s New Problem Areas

By Mark LaPedus - 19 Mar, 2018 - Comments: 2

Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

TFETs Cut Sub-Threshold Swing

By Katherine Derbyshire - 16 Mar, 2017 - Comments: 0

One of the main obstacles to continued transistor scaling is power consumption. As gate length decreases, the sub-threshold swing (SS) — the gate voltage required to change the drain current by one order of magnitude — increases. As Qin Zhang, Wei Zhao, and Alan Seabaugh of Notre Dame explained in 2006, SS faces a theoretical minimum of 60 mV/decade at room temperature in conventional MO... » read more

System Bits: Dec. 27

By Ann Mutschler - 27 Dec, 2016 - Comments: 0

Melting quantum crystal of electrons Confirming a fundamental phase transition in quantum mechanics that was theoretically proposed more than 80 years ago but not experimentally documented until now, MIT researchers reported that they’ve observed a highly ordered crystal of electrons in a semiconducting material and documented its melting, much like ice thawing into water. The team said i... » read more

Manufacturing Bits: June 14

By Mark LaPedus - 14 Jun, 2016 - Comments: 0

3D printed neural networks The European Commission has launched a program that will replicate the brain’s neural network using 3D nano-printing. The program, dubbed the MESO-BRAIN consortium, has received an award of €3.3 million in funding from the European Commission. This research, led by Aston University, also involves Axol Bioscience, Laser Zentrum, the University of Barcelona, th... » read more

Manufacturing Bits: March 29

By Mark LaPedus - 29 Mar, 2016 - Comments: 0

Brain-inspired computing Lawrence Livermore National Laboratory (LLNL) has purchased a brain-inspired supercomputing platform for deep learning developed by IBM Research. Based on a neurosynaptic computer chip called IBM TrueNorth, the scalable platform will process the equivalent of 16 million neurons and 4 billion synapses. It will consume the energy equivalent of a tablet computer. ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?