tag: D2S

Inverse lithography technology: 30 years from concept to practical, full-chip reality
By Technical Paper Link - 01 Oct, 2021 - Comments: 0

Published in the Journal of Micro/Nanopatterning, Materials, and Metrology, Aug. 31, 2021. Read the full technical paper here (open access). Abstract In lithography, optical proximity and process bias/effects need to be corrected to achieve the best wafer print. Efforts to correct for these effects started with a simple bias, adding a hammer head in line-ends to prevent line-end shortening. T... » read more

System-In-Package Thrives In The Shadows
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Optimizing VSB Shot Count For Curvilinear Masks
By Jan Willis - 19 Aug, 2021 - Comments: 0

The increased photomask write time using a variable-shape e-beam (VSB) writer has been a barrier to the adoption of inverse lithography technology (ILT) beyond the limited usage for hot spots. The second installment of this video blog looked at the challenge in depth. In this five-minute panel video with industry luminaries, Ezequiel Russell describes the collaborative study between his company... » read more

The Great Quantum Computing Race
By Mark LaPedus - 26 Jul, 2021 - Comments: 0

Quantum computing is heating up, as a growing number of entities race to benchmark, stabilize, and ultimately commercialize this technology. As of July 2021, a group from China appears to have taken the lead in terms of raw performance, but Google, IBM, Intel and other quantum computer developers aren’t far behind. All of that could change overnight, though. At this point, it's too early t... » read more

What About Mask Rule Checking For Curvilinear Photomasks?
By Jan Willis - 22 Jul, 2021 - Comments: 0

The entire photomask design chain needs to be considered in the adoption of curvilinear photomasks. A broad look at the ecosystem impact was addressed in a previous video but a more in-depth look at the design chain of photomasks raises the next question – will MRC be harder and take more time? Aki Fujimura of D2S opens the nine-minute panel video with industry luminaries by providing a conce... » read more

Survey: 2020 eBeam Initiative Annual Survey Results
By eBeam Initiative - 21 Jul, 2021 - Comments: 0

Aki Fujimura, the CEO of D2S, Inc. presented "The eBeam Initiative's Annual Survey Results at Photomask" at Photomask Japan 2021 in April 2021. Survey says that COVID has a net neutral business impact on total mask revenues. By 2021, 24% positive vs 20% negative COVID-related business predictions. 74% agree actinic inspection for EUV HVM by 2023, and more results. Click here to read more. » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Jul, 2021 - Comments: 0

Chipmakers and OEMs More delays and product woes at Intel. “INTC disclosed that it is delaying the launch of its next-generation Xeon server processor Sapphire Rapids (10nm) from the end of this year to 1Q22 due to additional validation needed for the chip,” said John Vinh, an analyst at KeyBanc, in a research note. “Production is expected to begin in 1Q22, with the ramp expected to begi... » read more

Finding, Predicting EUV Stochastic Defects
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Several vendors are rolling out next-generation inspection systems and software that locates problematic defects in chips caused by processes in extreme ultraviolet (EUV) lithography. Each defect detection technology involves various tradeoffs. But it’s imperative to use one or more of them in the fab. Ultimately, these so-called stochastic-induced defects caused by EUV can impact the perf... » read more

Developing A New Curvilinear Data Format
By Jan Willis - 17 Jun, 2021 - Comments: 0

The data size generated by curvilinear masks could impact turnaround time (TAT) for photomask production and hence the adoption of curvilinear masks. In a previous blog on curvilinear masks, our panel of luminaries discuss some possible solutions in a video discussion. In this seventh video, the panel looks at some ideas to define a new curvilinear data format to reduce file sizes. Aki Fujimura... » read more

How Will The Adoption Of Curvilinear Masks Affect Turnaround Time?
By Jan Willis - 01 Jun, 2021 - Comments: 0

Turnaround time (TAT) for photomask makers has historically increased at smaller and smaller process nodes, as reported in the eBeam Initiative Mask Makers surveys, so it’s important to look at the impact of curvilinear masks on TAT. In this sixth installment of our blog series on curvilinear masks, Aki Fujimura of D2S explores this question with luminaries in the industry during a video pane... » read more

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