tag: Daegu Gyeongbuk Institute of Science and Technology

Chip Industry Technical Paper Roundup: Jan. 16
By Liz Allan - 16 Jan, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=188 /] More ReadingTechnical Paper Library home » read more

Demonstrating A 2D–0D Hybrid Optical Multi-Level Memory Device Operated By Laser Pulses
By Technical Paper Link - 11 Jan, 2024 - Comments: 0

A technical paper titled “Probing Optical Multi-Level Memory Effects in Single Core–Shell Quantum Dots and Application Through 2D-0D Hybrid Inverters” was published by researchers at Korea Institute of Science and Technology (KIST), Korea University, Daegu Gyeongbuk Institute of Science and Technology (DGIST), National Institute for Materials Science (Japan), and University of Science and... » read more

Research Bits: Dec. 18
By Jesse Allen - 18 Dec, 2023 - Comments: 0

Stacking 2D layers for AI processing Researchers from Washington University in St. Louis, MIT, Yonsei University, Inha University, Georgia Institute of Technology, and the University of Notre Dame demonstrated monolithic 3D integration of layered 2D material, creating a novel AI processing hardware that integrates sensing, signal processing, and AI computing functions into a single chip. Th... » read more

Memory and Energy-Efficient Batch Normalization Hardware
By Technical Paper Link - 17 Nov, 2022 - Comments: 0

A new technical paper titled "LightNorm: Area and Energy-Efficient Batch Normalization Hardware for On-Device DNN Training" was published by researchers at DGIST (Daegu Gyeongbuk Institute of Science and Technology). The work was supported by Samsung Research Funding Incubation Center. Abstract: "When training early-stage deep neural networks (DNNs), generating intermediate features via con... » read more

Power/Performance Bits: Dec. 28
By Jesse Allen - 28 Dec, 2021 - Comments: 0

Shrinking LEDs Researchers from King Abdullah University of Science and Technology (KAUST) are working to make LEDs smaller. Micrometer-scale light-emitting diodes (μLEDs) could be an ideal building block for future microLED displays, but devices based on nitride-based alloys used to achieve a broad color range become poor emitters of light when shrunk to micrometer scales. “The main ... » read more

Power/Performance Bits: Aug. 18
By Jesse Allen - 18 Aug, 2020 - Comments: 0

Flexible, hole-filled films Researchers from Daegu Gyeongbuk Institute of Science and Technology (DGIST) and Hongik University propose a simple way to make flexible electrodes and thin film transistors last longer: adding lots of tiny holes. A major problem with flexible electronics is the formation of microscopic cracks after repeated bending which can cause the device to lose its conducti... » read more

Power/Performance Bits: April 14
By Jesse Allen - 14 Apr, 2020 - Comments: 0

Undoped polymer ink Researchers at Linköping University, Chalmers University of Technology, University of Washington, University of Cologne, Chiba University, and Yunnan University developed an organic ink for printable electronics that doesn't need to be doped for good conductivity. "We normally dope our organic polymers to improve their conductivity and the device performance. The proces... » read more

Power/Performance Bits: April 16
By Jesse Allen - 16 Apr, 2019 - Comments: 0

Faster CNN training Researchers at North Carolina State University developed a technique that reduces training time for deep learning networks by more than 60% without sacrificing accuracy. Convolutional neural networks (CNN) divide images into blocks, which are then run through a series of computational filters. In training, this needs to be repeated for the thousands to millions of images... » read more

System Bits: Feb. 19
By Jeff Dorsch - 19 Feb, 2019 - Comments: 0

Eco-friendly material for wireless IoT sensors Researchers at Canada’s Simon Fraser University and in Switzerland collaborated on developing a wood-derived cellulose material that could be used in a 3D printer, instead of the customary plastic and polymeric materials for electronics. With 3D printing, the material can offer flexibility to add or embed functions onto 3D shapes or fabrics, the... » read more

System Bits: Sept. 11
By Ann Mutschler - 11 Sep, 2018 - Comments: 0

Researchers ‘teleport’ a quantum gate In a key architectural step for building modular quantum computers, Yale University researchers have demonstrated the teleportation of a quantum gate between two qubits, on demand. [caption id="attachment_24137942" align="alignleft" width="300"] A network overview of the modular quantum architecture demonstrated in the new study.Source: Yale Universit... » read more

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