The Vital Role Of 1.6T Networking In Emerging Technology

By Ben Miller - 23 Feb, 2023 - Comments: 0

Although warehouses filled with acres of buzzing server racks may not seem like the most likely places to find exciting new technology, data centers play a crucial role in the emerging technologies of tomorrow. Industry 4.0, artificial intelligence (AI), virtual reality (VR), metaverse, and Internet-of-Things (IoT) are all high-demand applications which rely on data centers to provide powerful ... » read more

How To Raise Reliability, Availability, And Serviceability Levels For HPC SoCs

By Charlie Matar - 09 Feb, 2023 - Comments: 0

By Charlie Matar, Rita Horner, and Pawini Mahajan While once the domain of large data centers and supercomputers, high-performance computing (HPC) has become rather ubiquitous and, in some cases, essential in our everyday lives. Because of this, reliability, availability, and serviceability, or RAS, is a concept that more HPC SoC designers should familiarize themselves with. RAS may sound... » read more

Ramping Up IC Predictive Maintenance

By Anne Meixner - 07 Feb, 2023 - Comments: 0

The chip industry is starting to add technology that can predict impending failures early enough to stave off serious problems, both in manufacturing and in the field. Engineers increasingly are employing in-circuit monitors embedded in SoC designs to catch device failures earlier in the production flow. But for ICs in the field, data tracing from design to application use only recently has ... » read more

An OSAT Perspective On Semiconductor Market Trends

By Vik Chaudhry - 19 Jan, 2023 - Comments: 0

For the semiconductor industry, 2022 was a very interesting year. On one hand, it witnessed shortages in the supply chain. On the other hand, the macro-economic situation turned and demand for several consumer and computing devices plummeted. A trade war with China and ensuing localization of supply chain with passage of CHIPS act took shape in 2022. The auto industry is still recovering from t... » read more

PCIe 6.0 Takes Data Center Performance To The Next Level

By Lou Ternullo - 12 Jan, 2023 - Comments: 0

Looking back at 2022, we saw a major update to the PCI Express (PCIe) specification. PCIe 6.0 brought with it some of the most fundamental changes yet seen by the specification, resulting in some exciting capabilities that are set to take data center performance to the next level in the years ahead. PCIe has been the interconnect of choice in computing for two decades now. Its ongoing advanc... » read more

Screening For Silent Data Errors

By Anne Meixner - 10 Jan, 2023 - Comments: 0

Engineers are beginning to understand the causes of silent data errors (SDEs) and the data center failures they cause, both of which can be reduced by increasing test coverage and boosting inspection on critical layers. Silent data errors are so named because if engineers don’t look for them, then they don’t know they exist. Unlike other kinds of faulty behaviors, these errors also can c... » read more

How The Electronics Industry Can Shape A More Sustainable, Energy-Efficient World

By Piyush Sancheti - 21 Dec, 2022 - Comments: 0

By Piyush Sancheti and Godwin Maben We’re already experiencing the effects of our world’s changing climate—devastating wildfires, prolonged droughts, torrential flooding, just to name a few examples. Global energy consumption is increasing, raising carbon dioxide levels and triggering extreme weather conditions. Two key forces driving these trends are the shift to hyperscale datacenter... » read more

Chip Sandwich: Electronics Chip & Photonics Chip Co-Optimized To Work Together (CalTech/Univ. of Southampton)

By Technical Paper Link - 01 Dec, 2022 - Comments: 0

A technical paper titled "A 100-Gb/s PAM4 Optical Transmitter in a 3-D-Integrated SiPh-CMOS Platform Using Segmented MOSCAP Modulators" was published by researchers at CalTech and University of Southampton. "The resulting optimized interface between the two chips allows them to transmit 100 gigabits of data per second while producing just 2.4 pico-Joules per transmitted bit. This improves th... » read more

Effective Measurement Is The Key To Meeting Environmental Sustainability Goals In Data Centers

By Neil Zaman - 22 Nov, 2022 - Comments: 0

Hyperscale compute, using high-performance connected processors, continually transforms our lives as more and more applications rely on this type of compute, and at the heart of this hyperscale revolution are data centers. It is estimated that an equal amount of power is required for the airflow and cooling systems as for IT equipment. The pressure is on for organizations to create and adopt l... » read more

Securing Accelerator Blades For Datacenter AI/ML Workloads

By Emma-Jane Crozier - 25 Oct, 2022 - Comments: 0

Data centers handle huge amounts of AI/ML training and inference workloads for their individual customers. Such a vast number of workloads calls for efficient processing, and to handle these workloads we have seen many new solutions emerge in the market. One of these solutions is pluggable accelerator blades, often deployed in massively parallel arrays, that implement the latest state-of-the-ar... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.