Chip Industry Week In Review

By The SE Staff - 21 Jun, 2024 - Comments: 0

BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

Why PCIe 7.0 Over Optics

By Keivan Javadi Khasraghi - 13 Jun, 2024 - Comments: 0

By Keivan Javadi Khasraghi and Ruben Sousa Data centers are currently facing the increasing need to enhance their bandwidth capacities. This surge is largely driven by the rise of new technologies, especially the growing demand for AI and machine learning applications. As these technologies advance, bandwidth requirements are projected to expand dramatically. As Large Language Models (LLMs) ... » read more

Liquid Cooling And GaN: A Winning Combination

By Paul Wiener - 06 Jun, 2024 - Comments: 0

Data centers are facing an unprecedented transformation due to the surge in generative AI and other emerging technologies. A single ChatGPT session consumes 50 to 100 times more energy than a comparable Google search, escalating data center rack power requirements towards 200 kW or more, presenting serious challenges for operators. Cooling, in fact, takes up about 40% of the power requireme... » read more

Securing AI In The Data Center

By Bart Stevens - 09 May, 2024 - Comments: 0

AI has permeated virtually every aspect of our digital lives, from personalized recommendations on streaming platforms to advanced medical diagnostics. Behind the scenes of this AI revolution lies the data center, which houses the hardware, software, and networking infrastructure necessary for training and deploying AI models. Securing AI in the data center relies on data confidentiality, integ... » read more

Linear Drive Optics May Reduce Data Latency

By Karen Heyman - 11 Apr, 2024 - Comments: 0

Optical and electrical are starting to cross paths at a much deeper level, particularly with the growing focus on 3D-ICs and AI/ML training in data centers, driving changes both in how chips are designed and how these very different technologies are integrated together. At the root of this shift are the power and performance demands of AI/ML. It can now take several buildings of a data cente... » read more

Integrating Energy Efficiency Considerations Into Your Design From The Beginning

By William Ruby - 11 Apr, 2024 - Comments: 0

Data center networking is responsible for consuming about 1% of the global electricity supply. With the advent and integration of AI into various sectors, the pressure on both hardware and software infrastructures, necessitated by neural networks and extensive language models, is expected to increase significantly. The burgeoning energy consumption by hyperscale data centers emerges as an ur... » read more

Strategies For Detecting Sources Of Silent Data Corruption

By Anne Meixner - 12 Mar, 2024 - Comments: 0

Engineering teams are wrestling with how to identify the root causes of silent data corruption (SDC) in a timely and cost-effective way, but the solutions are turning out to be broader and more complex than simply fixing a single defect. This is particularly vexing for data center reliability, accessibility and serviceability (RAS) engineering teams, because even the best tools and methodolo... » read more

Examining The Impact Of Chip Power Reduction On Data Center Economics

By Noam Brousard - 12 Mar, 2024 - Comments: 1

In the rapidly evolving landscape of data centers, optimizing energy consumption has become a critical focus. In this blog post, we'll delve into the intricacies of power consumption, exploring the economics of three key components: CPUs, GPUs, and AI accelerators, and how the implementation of proteanTecs power reduction solution transforms both power efficiency and computational capabilities... » read more

Yield Tracking In RDL

By Ed Sperling - 07 Feb, 2024 - Comments: 0

Yield is a much bigger issue when it comes to panel-level packages, which may contain up to 24 RDL layers. Just finding the defects is a massive challenge, let alone understanding how they will impact the entire device. Many of these advanced packages are being used in data centers for generative AI, and killer defects caused by bridges and opens can cause serious problems. What happens, for in... » read more

Why There Are Still No Commercial 3D-ICs

By Brian Bailey - 29 Jan, 2024 - Comments: 0

Building chips in three dimensions is drawing increased attention and investment, but so far there have been no announcements about commercial 3D-IC chips. There are some fundamental problems that must be overcome and new tools that need to be developed. In contrast, the semiconductor industry is becoming fairly comfortable with 2.5D integration, where individual dies are assembled on some k... » read more

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