PCIe 5.0 Drill-Down


Suresh Andani, senior director of product marketing for SerDes IP at Rambus, digs into the new PCI Express standard, why it’s so important for data centers, how it compares with previous versions of the standard, and how it will fit into existing and non-von Neumann architectures. » read more

Designing Resilient Electronics


Electronic systems in automobiles, airplanes and other industrial applications are becoming increasingly sophisticated and complex, required to perform an expanding list of functions while also becoming smaller and lighter. As a result, pressure is growing to design extremely high-performance chips with lower energy consumption and less sensitivity to harsh environmental conditions. If this ... » read more

New Architectural Issues Facing Auto Ecosystem


As chips bound for the automotive world move to small process nodes, including 5nm and below, the automotive ecosystem is wrestling with both scaling issues and challenges related to architecting safety-critical systems using fewer chips. This may sound counterintuitive, because one of the main reasons automotive chip providers are moving to smaller nodes is to reduce the number of chips in ... » read more

The Future Of Embedded Monitoring, Part 1


Shall I compare thee to a…Rolls Royce jet engine? ‘There is a new era dawning whereby deeply embedded sensing within all technology will bring about great benefit for the reliability and performance of semiconductor-based products.’ These were my words during a presentation to an industry audience in China back in September 2015. During that same presentation, somewhat to the consterna... » read more

AI: A Perfect Solution But At What Cost?


The advancement of artificial intelligence (AI) has been a great enabler for the Internet of things (IoT). Given the ability to think for itself, it’s shrugged off its original definition as a network of tiny sensors and grown to incorporate a host of more intelligent AIoT (AI+IoT) devices, from smartphones all the way up to autonomous vehicles. AI has also paved the way for new IoT device... » read more

More Data, More Problems In Automotive


The race toward increasing levels of autonomy is being hampered by competitive concerns over sharing data across the automotive supply chain. Pushing past the initial ADAS levels into full autonomy is expected to take more than a decade, but the infrastructure for those systems, and making sure all assisted and autonomous vehicles work with other vehicles, is under development today. Still, ... » read more

Things That Go Bump In The Daytime


There is no argument that autonomous technology is better at certain things than systems controlled by people. A computer-guided system has only one mission — to stay on the road, avoid object, and reach the end destination. It doesn't get tired, text, or look out the window. And it can park within a millimeter of a wall or another vehicle without hitting it, and do that every time — as lon... » read more

Scaling, Packaging, And Partitioning


Prior to the finFET era, most chipmakers either focused on shrinking or packaging, but they rarely did both. Going forward, the two will be inseparable, and that will lead to big challenges with partitioning of data and processing. The key driver here, of course, is that device scaling no longer provides appreciable benefits in power, performance and cost. Nevertheless, scaling does provide ... » read more

Verification In The Era Of Autonomous Driving, Artificial Intelligence And Machine Learning


The last couple of weeks have been busy with me participating on three panels that dealt with AI and machine learning in the contexts of automotive and aero/defense, in San Jose, Berlin and Detroit. The common theme? Data is indeed the new oil, and it messes with traditional value creation in electronics. Also, requirements for system design and verification are changing and there are completel... » read more

Compressing Datasets Created During Silicon Design


Authors: Guru Rao, Distinguished Engineer; Shakir Abbas, Software Engineering Group Director; Mohammad Mirfendereski, Configuration Management Architect; Cadence. Harsh Sharangpani, CEO and CTO; Rajesh Patil, VP-Business Development; Ascava. During the design cycle for modern semiconductor components, a very large amount of data is generated and stored, often accumulating to hundreds of tera... » read more

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