Ensuring HBM Reliability


Igor Elkanovich, CTO of GUC, and Evelyn Landman, CTO of proteanTecs, talk with Semiconductor Engineering about difficulties that crop up in advanced packaging, what’s redundant and what is not when using high-bandwidth memory, and how continuous in-circuit monitoring can identify potential problems before they happen. » read more

Degradation Monitoring


This paper describes a reliability degradation modeling and monitoring method based on a combination of IC novel embedded circuits (Agents), and off-chip machine learning algorithms which infer the digital readouts of these circuits during test and operational lifetime. Together, they monitor the margin degradation of an IC, as well as other vital parameters of the IC and its environmental s... » read more

Reliability In Automotive Chips


Roland Jancke, head of department for design methodology at Fraunhofer IIS’ Engineering of Adaptive Systems Division, looks at how to ensure that chips used in cars are reliable over extended periods of use, how mission profiles vary depending upon where they are used, and why it’s important to understand what chips developed at the latest nodes can really be used for and how they will be ... » read more

How Chips Age


Andre Lange, group manager for quality and reliability at Fraunhofer IIS’ Engineering of Adaptive Systems Division, talks about circuit aging, whether current methods of predicting reliability are accurate for chips developed at advanced process nodes, and where additional research is needed. » read more

Symptoms Of SoC Electromagnetic (EM) Crosstalk


By Anand Raman and Magdy Abadir Have you ever had your silicon demonstrate unexpected behavior? Have you ever found unexplainable design failure or performance degradation? A number of issues could be the culprit - from overloaded signal nets, a noisy power grid, or increasing temperature - but one problem often overlooked is electromagnetic (EM) crosstalk. Electromagnetic (EM) crosstal... » read more