Understanding the mission profile and how that changes over time.
Roland Jancke, head of department for design methodology at Fraunhofer IIS’ Engineering of Adaptive Systems Division, looks at how to ensure that chips used in cars are reliable over extended periods of use, how mission profiles vary depending upon where they are used, and why it’s important to understand what chips developed at the latest nodes can really be used for and how they will be characterized.
Less precision equals lower power, but standards are required to make this work.
Open source by itself doesn’t guarantee security. It still comes down to the fundamentals of design.
Ensuring that your product contains the best RISC-V processor core is not an easy decision, and current tools are not up to the task.
Wafer manufacturing and GPUs draw investment; 106 companies raise $2.8B.
Heterogenous integration depends on reliable TSVs, microbumps, vias, lines, and hybrid bonds — and time to digest all the options.
Less precision equals lower power, but standards are required to make this work.
New memory approaches and challenges in scaling CMOS point to radical changes — and potentially huge improvements — in semiconductor designs.
113 startups raise $3.5B; batteries, AI, and new architectures top the list.
127 startups raise $2.6B; data center connectivity, quantum computing, and batteries draw big funding.
Thermal mismatch in heterogeneous designs, different use cases, can impact everything from accelerated aging to warpage and system failures.
New applications require a deep understanding of the tradeoffs for different types of DRAM.
Electromigration and other aging factors become more complicated along the z axis.
Why and when it’s needed, and what tools and technologies are required.
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