Computational Imaging Craves System-Level Design And Simulation Tools To Leverage Disruptive AI In Embedded Vision

By Synopsys - 24 May, 2023 - Comments: 0

Image quality now relies more than ever on high computing power tied to miniaturized optics and sensors, rather than on standalone and bulky but aberration-free optics. This new trend is called computational imaging and can be used either for computational photography or for computer vision. Read this white paper to learn about market trends and promising system co-design and co-optimization ap... » read more

Ensuring Data Integrity And Performance Of High-Speed Data Transmission

By Cadence - 05 Oct, 2022 - Comments: 0

In key electronics applications such as data centers, automotive, and 5G, the data speed and volume are increasing at an exponential rate. Data centers require data transmission (Figure 1) as high as 112Gbps, which can be achieved only using PAM4 signaling. The automotive industry is dealing with the challenges of transferring data between various electronic control units (ECUs) at a very high ... » read more

Solution Efficiencies For Dynamic Function eXchange Using Abstract Shells

By Xilinx - 04 Aug, 2021 - Comments: 0

Dynamic Function eXchange (DFX) enables great flexibility within Xilinx® silicon, empowering you to load applications on demand, deliver updates to deployed systems, and reduce power consumption. Platform designs allow for collaboration between groups, where one group can focus on infrastructure and another on hardware acceleration. However, DFX has fundamental flow requirements that lead to l... » read more

Machine Learning — Everywhere: Enabling Self-Optimizing Design Platforms for Better End-to-End Results

By Synopsys - 13 Jan, 2021 - Comments: 0

Machine-learning offers opportunities to enable self-optimizing design tools. Very much like self-driving cars that observe real-world interactions to improve their responses in different (local) driving conditions, AI-enhanced tools are able to learn and improve in (local) design environments after deployment. These new, ML-driven capabilities can be embedded in different design engines, gi... » read more

EDA Gears Up For 3D

By Brian Bailey - 26 Aug, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: design tools

Computational Imaging Craves System-Level Design And Simulation Tools To Leverage Disruptive AI In Embedded Vision

Ensuring Data Integrity And Performance Of High-Speed Data Transmission

Solution Efficiencies For Dynamic Function eXchange Using Abstract Shells

Machine Learning — Everywhere: Enabling Self-Optimizing Design Platforms for Better End-to-End Results

EDA Gears Up For 3D