Computational Imaging Craves System-Level Design And Simulation Tools To Leverage Disruptive AI In Embedded Vision


Image quality now relies more than ever on high computing power tied to miniaturized optics and sensors, rather than on standalone and bulky but aberration-free optics. This new trend is called computational imaging and can be used either for computational photography or for computer vision. Read this white paper to learn about market trends and promising system co-design and co-optimization ap... » read more

Ensuring Data Integrity And Performance Of High-Speed Data Transmission


In key electronics applications such as data centers, automotive, and 5G, the data speed and volume are increasing at an exponential rate. Data centers require data transmission (Figure 1) as high as 112Gbps, which can be achieved only using PAM4 signaling. The automotive industry is dealing with the challenges of transferring data between various electronic control units (ECUs) at a very high ... » read more

Solution Efficiencies For Dynamic Function eXchange Using Abstract Shells


Dynamic Function eXchange (DFX) enables great flexibility within Xilinx® silicon, empowering you to load applications on demand, deliver updates to deployed systems, and reduce power consumption. Platform designs allow for collaboration between groups, where one group can focus on infrastructure and another on hardware acceleration. However, DFX has fundamental flow requirements that lead to l... » read more

Machine Learning — Everywhere: Enabling Self-Optimizing Design Platforms for Better End-to-End Results


Machine-learning offers opportunities to enable self-optimizing design tools. Very much like self-driving cars that observe real-world interactions to improve their responses in different (local) driving conditions, AI-enhanced tools are able to learn and improve in (local) design environments after deployment. These new, ML-driven capabilities can be embedded in different design engines, gi... » read more

EDA Gears Up For 3D


Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more