Manufacturing Bits: June 23

By Mark LaPedus - 23 Jun, 2015 - Comments: 0

Diamond shock waves For years, the industry has been exploring the use of diamonds for electronics applications. Diamonds could be used to reduce heat in electronic systems. In addition, diamond FETs are also intriguing. Diamond has a wide bandgap (5.45 eV), a high breakdown field (10MV/cm), and high thermal conductivity (22W/cmK). But it could take years before diamond FETs reach the mains... » read more

Manufacturing Bits: Nov. 25

By Mark LaPedus - 25 Nov, 2014 - Comments: 0

Direct-write diamond patterning Purdue University has devised a new technique that uses a pulsing laser to create synthetic nanodiamond films and patterns on a graphite substrate. The ability to pattern diamond surfaces could one day be used to make chips, biosensors and fuel cells. In the lab, researchers devised a multi-layered film, which includes a layer of graphite topped with a glass ... » read more

Manufacturing Bits: Oct. 29

By Mark LaPedus - 29 Oct, 2013 - Comments: 0

Diamond chips The optical transistor, which transports photons, holds great promise. Photons are not only faster than electrons, but they have less crosstalk. But optical transistors are also expensive and difficult to produce. In a possible breakthrough, the ICFO-Institute of Photonic Sciences has demonstrated a “nano-size” diamond that can act as an efficient optical switch. Researche... » read more

New Approaches To Better Performance And Lower Power

By Ed Sperling - 11 Jul, 2013 - Comments: 0

By Ed Sperling Until 90nm, every feature shrink and rev of Moore’s Law included a side benefit of better power and performance. After that, improvements involved everything from different back-end processes to copper interconnects and transistor structures. But from 20nm onward, the future will rest with a combination of new materials, new architectures and new packaging approaches—and som... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: diamond

Manufacturing Bits: June 23

Manufacturing Bits: Nov. 25

Manufacturing Bits: Oct. 29

New Approaches To Better Performance And Lower Power