Applications, Challenges For Using AI In Fabs

By Mark LaPedus - 14 Apr, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss chip scaling, transistors, new architectures, and packaging with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fujimura, CEO of D2S. Wh... » read more

Digital Transformation In Aerospace And Defense Applications

By Frank Schirrmeister - 25 Mar, 2021 - Comments: 0

Watching the aerospace and defense verticals, one of the most impactful publications in 2020 was probably Will Roper's "There Is No Spoon: The New Digital Acquisition Reality." Using visuals from "The Matrix", which at the time was called "the first movie of the 21st century," the Assistant Secretary of the Air Force for Acquisition, Technology, and Logistics painted a picture of a "simulation ... » read more

Advancing IC And Systems Design With The Digital Twin

By Joseph Sawicki - 25 Feb, 2021 - Comments: 0

As many of you may have seen, we’ve passed a major milestone since Siemens announced its intent to acquire Mentor Graphics four years ago. As of January 1, 2021, “Mentor, a Siemens business” has become “Siemens EDA” and remains a segment of the larger Siemens Digital Industries Software organization. Siemens is bringing together one of the world’s most comprehensive EDA portfolios w... » read more

Hyperscaling Cyber-Physical Systems

By Frank Schirrmeister - 25 Feb, 2021 - Comments: 0

As consumers, we are not always aware of all the data created around us by our cars, mobile devices, computers, and day-to-day consumer products. In most cases, we are even less aware of what's going on during the development and production of today's devices and systems that we have gotten so used to. During the most recent DATE 2021 conference, the special day on cyber-physical systems gave s... » read more

Big Challenges In Verifying Cyber-Physical Systems

By Ed Sperling - 25 Feb, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss cyber-physical systems and how to verify them with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Frank Schirrmeister, senior group director for solution marketing at Cadence; Maurizio Griva, R&D Manager at Reply; and Laurent Maillet-Contoz, system and architect specialist at STMicroelectronics. This discussion was... » read more

The Chip Industry’s Next-Gen Roadmap

By Mark LaPedus - 21 Jan, 2021 - Comments: 1

Todd Younkin, the new president and chief executive of the Semiconductor Research Corp. (SRC), sat down with Semiconductor Engineering to talk about engineering careers, R&D trends and what’s ahead for chip technologies over the next decade. What follows are excerpts of that conversation. SE: As a U.S.-based chip consortium, what is SRC's charter? Younkin: The Semiconductor Research... » read more

New Security Approaches, New Threats

By Ed Sperling - 09 Dec, 2020 - Comments: 0

New and different approaches to security are gaining a foothold as the life expectancy for advanced chips increases, and as emerging technologies such as quantum computing threaten to crack even the most complex encryption schemes. These approaches include everything from homomorphic encryption, where data is processed without being decrypted, to different ways of sending and receiving data ... » read more

Selective Redundancy In Cars

By Ed Sperling - 10 Nov, 2020 - Comments: 0

The automotive industry has been fish-tailing its way through design strategies and electronics architectures, but it finally appears to be honing in on a strategy that actually might work. This doesn't mean fully autonomous vehicles will take over the road anytime soon, but at least it points carmakers in the right direction. The auto industry has been in panic mode ever since Tesla, Waymo,... » read more

How End-To-End Solutions Support Tomorrow’s Automotive Electrical Systems

By Dan Scott - 05 Nov, 2020 - Comments: 0

We are living in a time of significant change and disruption in the automotive industry. The amount of electrical and electronic content in today’s vehicles continues to explode as consumers demand greater personalization of products and regular feature updates, and as tomorrow’s technologies such as autonomous and electric drive continue to develop. Meanwhile, established carmakers are gra... » read more

Performance and Power Tradeoffs At 7/5nm

By Ed Sperling - 27 Oct, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss power optimization with Oliver King, CTO at Moortec; João Geada, chief technologist at Ansys; Dino Toffolon, senior vice president of engineering at Synopsys; Bryan Bowyer, director of engineering at Mentor, a Siemens Business; Kiran Burli, senior director of marketing for Arm's Physical Design Group; Kam Kittrell, senior product management group d... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: digital twins