tag: DRAM

China’s Fab Tool Biz Heats Up
By Mark LaPedus - 28 Oct, 2015 - Comments: 0

For years, China has been a steady growth market for suppliers of semiconductor equipment. Internally, though, the country is comprised of trailing-edge fabs and IC-assembly houses, which means equipment vendors sell relatively mature tools and compete on price. That’s about to change, however. Today, the IC equipment business is heating up in China as the nation begins to upgrade and pour... » read more

What China Is Planning
By Mark LaPedus - 21 Oct, 2015 - Comments: 1

Over the years, China has unveiled several initiatives to advance its domestic semiconductor industry. China has made some progress at each turn, although every plan has fallen short of expectations. But now, the nation is embarking on several new and bold initiatives that could alter the IC landscape. China’s new initiatives address at least three key challenges for its IC industry: 1. C... » read more

Is The 2.5D Supply Chain Ready?
By Ed Sperling - 28 Sep, 2015 - Comments: 0

A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

Inside The MRAM
By Mark LaPedus - 17 Sep, 2015 - Comments: 0

Today, the industry is shipping various next-generation nonvolatile memory types, such as 3D NAND, MRAM and ReRAM. In fact, MRAM has been shipping for some time. To get a handle on MRAM, Semiconductor Engineering sat down to discuss the technology with Phillip LoPresti, president and chief executive of Everspin, a supplier of MRAMs. What follows are excerpts of that conversation. SE: Where ... » read more

ALD Market Heats Up
By Mark LaPedus - 17 Sep, 2015 - Comments: 1

Amid the shift to 3D NAND, finFETs and other device architectures, the atomic layer deposition (ALD) market is heating up on several fronts. Applied Materials, for example, recently moved to shakeup the landscape by rolling out a new, high-throughput ALD tool. Generally, [getkc id="250" kc_name="ALD"] is a process that deposits materials layer-by-layer at the atomic level, enabling thin and ... » read more

Executive Insight: Charlie Cheng
By Ed Sperling - 14 Sep, 2015 - Comments: 1

Charlie Cheng, CEO of Kilopass, sat down with Semiconductor Engineering to talk about issues with current memory types and why the market is ready for disruptive approaches to reduce power and cost. SE: What's changing in the memory space? Cheng: Memory is a very important building block. It's a foundation and a commodity for a chip and for the system, but if you look at the big picture, ... » read more

Which Memory Type Should You Use?
By Loren Shalinsky - 10 Sep, 2015 - Comments: 1

I continue to get besieged by statements in which memory “latency” and “bandwidth” get misused. As I mentioned in my last blog, latency is defined as how long the CPU needs to wait before the first data is available, while bandwidth is how fast additional data can be “streamed” after the first data point has arrived. Bandwidth becomes a bigger factor in performance when data is stor... » read more

Inside The 5G Smartphone
By Mark LaPedus - 20 Aug, 2015 - Comments: 3

Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. In fact, major carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Intel, Samsung and Qualcom... » read more

Tech Talk: DDR4
By Ed Sperling - 17 Aug, 2015 - Comments: 1

Rambus' Ely Tsern digs into the challenges in integrating DDR4 compared with DDR3 and why it will get even more difficult over the next few iterations. [youtube vid=2M6vFweaZ-M] » read more

2.5D Creeps Into SoC Designs
By Ed Sperling - 13 Aug, 2015 - Comments: 0

A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

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