tag: DSMBGA

How AiP/AoP Technology Helps Enable 5G And More
By Brendan Wells - 16 Feb, 2023 - Comments: 0

For 5G smartphones and other millimeter wave (mmWave) applications, antenna integration off the board and into the package, simplifies the design challenges endemic to high-frequency devices. These challenges include signal loss, signal integrity, and power supply limitation. Antenna in Package (AiP) and Antenna on Package (AoP) constructions provide the required form, fit and function for high... » read more

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO
By Nathan Whitchurch - 15 Sep, 2022 - Comments: 0

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more

Enabling The 5G RF Front-End Module Evolution With The DSMBGA Package
By Amkor - 21 Jul, 2022 - Comments: 0

The advanced SiP double-sided molded BGA platform has become an industry technology standard in this domain. Applying leading-edge design rules for 3D component placement and double-sided molding, together with conformal and compartmental shielding and in-line RF testing, delivers integration levels in a small form factor with high yield. In addition to formidable SiP capacity and DSMBGA techno... » read more

The New Technology Solutions For Advanced SiP Devices
By YongJai Seo - 18 Nov, 2021 - Comments: 0

For many years, System-in-Package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased complexity and higher package density for SiP devices has driven the development of new packaging technologies. In response, compartmental shield technology makes it possible to put several functions int... » read more

The New Technology Solutions For Advanced SiP Devices
By YongJai Seo - 21 Oct, 2021 - Comments: 0

For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased complexity and higher package density for SiP devices has driven the development of new packaging technologies. In response, compartmental shield technology makes it possible to put several functions int... » read more

System-In-Package Thrives In The Shadows
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Empowering RF Front End Cellular Innovations With DSMBGA
By Curtis Zwenger - 19 Aug, 2021 - Comments: 0

With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other 5G-enabled devices. Double-sided, molded ball grid array (DSMBGA) is a prime example of such solutions. “With our DSMBGA platform, we’ve established a preferred advanced packaging solution for this domain,”... » read more

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy