tag: eASIC

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 20 Nov, 2020 - Comments: 0

Pervasive computing — Data centers, cloud, 5G, edge In a move to improve data collection for IC manufacturing, PDF Solutions entered a definitive agreement to acquire Cimetrix Incorporated. Cimetrix makes connectivity products for smart manufacturing, which PDF Solutions will use in its Exensio product to facilitate moving IC manufacturing data from the factory floor to cloud-based analytics... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Jul, 2018 - Comments: 0

Chipmakers GlobalFoundries said that the company’s 22nm FD-SOI technology has delivered more than $2 billion worth of client design win revenue. With more than 50 total client designs, the technology is designed for automotive, 5G connectivity and the Internet of Things (IoT). Helic has announced that its electromagnetic (EM) modeling engine has been certified for GlobalFoundries’ 22nm ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 13 Jul, 2018 - Comments: 0

M&A Intel will acquire fabless company eASIC. Founded in 1999, eASIC sells structured ASIC platforms that act as a midpoint between FPGAs and standard cell ASICs by combining FPGA-like logic and design flows with single via routing. Eventually, Intel sees potential in using its Embedded Multi-Die Interconnect Bridge (EMIB) technology to combine Intel FPGAs with structured ASICs in a system... » read more

The Week In Review: Design
By Jesse Allen - 28 Apr, 2017 - Comments: 0

IP ARM launched the Mali-C71 image signal processor (ISP), targeting ADAS SoCs. The ISP is capable of processing up to 4 real-time cameras and 16 camera streams with a single pipeline and provides advanced error detection with more than 300 dedicated fault detection circuits. Included is full reference software to control the ISP, sensor, auto white balance and auto exposure. Synopsys ext... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Aug, 2015 - Comments: 0

NuFlare Technology wants to enter a new market. The e-beam giant and NGR are jointly collaborating on a development program for next-generation electron-beam wafer inspection and metrology. It’s unclear if NuFlare is developing a single- or multi-beam tool, however. Don’t look now, but a fab tool downturn could be on the horizon. This comes amid a slowdown in PCs, tablets and smartphone... » read more

Foundries Expand Planar Efforts
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

The Week In Review: Design/IoT
By Jesse Allen - 20 Feb, 2015 - Comments: 0

Deals Arteris teamed up with Yogitech to integrate the two companies' products. They're planning a set of ISO 26262 deliverables for a series of SoC reference designs and a functional safety assessment of the Arteris FlexNoC interconnect IP. ARM and Green Hills Software collaborated on an optimized compiler for the Cortex-R5 processor. The compiler achieved a score of 1.01EEMBC Automarks/... » read more

The Week In Review: Design/IoT
By Ed Sperling - 30 Jan, 2015 - Comments: 0

Mergers/Acquisitions Lattice Semiconductor agreed to pay $600 million for Silicon Image, which makes connectivity solutions for high-definition content for mobile and consumer electronics. Lattice already makes programmable connectivity solutions, so the combined IP portfolio is expected to strengthen its position in wired and wireless markets. Tools Cadence expanded the tool portfolio it ... » read more

Waiting For Next-Generation Lithography
By Mark LaPedus - 23 Jan, 2014 - Comments: 2

Nearly 30 years ago, optical lithography was supposed to hit the wall at the magical 1 micron barrier, prompting the need for a new patterning technology such as direct-write electron beam and X-ray lithography. At that time, however, the industry was able to push optical lithography for volume chip production at the 1-micron node and beyond. This, in turn, effectively killed direct-write e-... » read more

The Week In Review: Aug. 12
By Ed Sperling - 12 Aug, 2013 - Comments: 0

By Mark LaPedus Is the sky falling on semi capital spending? “We have seen several 2014 industry demand estimates in the 20%+ range, based on the ramps of FinFET and 3D NAND,” said Weston Twigg, an analyst with Pacific Crest Securities. “We expect Samsung to ramp spending in Q4, but we believe foundry and logic spending will remain soft for several quarters. As a result, we are developin... » read more

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