tag: ECTC

Chip Industry Technical Paper Roundup: Sept. 9
By Linda Christensen - 09 Sep, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=354 /] More ReadingTechnical Paper Library home » read more

ECTC 2024 Session Readout: Advancement of Metrology
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A Electronic Components and Technology Conference (ECTC) session report titled "2024 ECTC Special Session Report: Advancing Metrology for Next-Generation Microelectronics" was published by NIST, Binghamton University, and TechSearch International. Abstract: "Metrology plays a pivotal role in semiconductor research, manufacturing, packaging and assembly. It is critical to the success of this... » read more

Photonic Debond: Scalability And Advancements
By Brewer Science - 17 May, 2023 - Comments: 0

Advanced packaging technology has continuously evolved over the past 10-20 years to become a major driving force in improving integrated circuit (IC) performance. This improvement in IC performance is assisted by the ability to place specialized components near each other for shorter interconnects in the IC packages. Temporary bond and debond (TB/DB) is an enabling technique for this work. TB/D... » read more

Piecing Together Chiplets
By Mark LaPedus - 22 Jul, 2021 - Comments: 3

Several companies are implementing the chiplet model as a means to develop next-generation 3D-like chip designs, but this methodology still has a long way to go before it becomes mainstream for the rest of the industry. It takes several pieces to bring up a 3D chip design using the chiplet model. A few large players have the pieces, though most are proprietary. Others are missing some key co... » read more

Manufacturing Bits: July 13
By Mark LaPedus - 13 Jul, 2021 - Comments: 0

Heterogenous III-V packaging At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), a group presented a paper on the development of a wafer-level fan-out package using heterogenous III-V devices. This paper deals with the packaging of two III-V chips for use in RF transceiver applications in base stations. III-V Lab, CEA-Leti, Thales and United Monolithic Semic... » read more

Week In Review: Manufacturing, Test
By Ed Sperling - 25 Jun, 2021 - Comments: 0

Lots more fabs and capacity The chip industry sees opportunity in shortages, and is racing to meet demand. SEMI reports 19 new worldwide high-volume fabs already have started construction, or will start by end of this year, and another 10 are scheduled in 2022. “Equipment spending for these 29 fabs is expected to surpass $140 billion over the next few years as the industry pushes to addre... » read more

Manufacturing Bits: June 22
By Mark LaPedus - 22 Jun, 2021 - Comments: 1

5G metasurface antennas At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), the Institute of Microelectronics of the Chinese Academy of Sciences (CAS) presented a paper on a low-profile broadband metasurface antenna for 5G antenna-in-package applications. The National Center for Advanced Packaging and the University of Chinese Academy of Sciences also contri... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Jun, 2021 - Comments: 0

Fab tools TEL plans to ship its leading-edge coater/developer system to the joint Imec-ASML research lab, which is working on high-NA extreme ultraviolet (EUV) lithography. The equipment will be integrated with the EXE:5000, ASML’s next-generation high-NA EUV lithography system. The 0.55 numerical aperture (NA) tool is slated to be operational in 2023. Today's EUV is in production, but there... » read more

Fan-Out Packaging Options Grow
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and sma... » read more

Geopolitical And Economic Outlook For Chips And Equipment
By Ed Sperling - 17 Jun, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss geopolitical and economic changes and how they affect the chip industry with Jean-Christophe Eloy, CEO of Yole Developpement; Risto Puhakka, president of VLSI Research; Carolyn Evans, chief economist at Intel; Duncan Meldrum, chief economist at Hilltop Economics; and Rozalia Beica, head of the semiconductor business at AT&S... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy