Electronic System Design Revenue Up 14.4% Y/Y in Q4 2021

By Ann Mutschler - 04 Apr, 2022 - Comments: 0

Electronic System Design (ESD) industry revenue increased 14.4% from $3.03 billion in Q4 2020 to $3.5 billion in Q4 2021, according to the latest Electronic Design Market Data (EDMD) report by ESD Alliance, a SEMI Technology Community. Walden C. Rhines, executive sponsor of the SEMI Electronic Design Market Data report noted, “The industry continued to report double-digit year-over-year re... » read more

DAC 2020 Day One

By Ann Mutschler - 21 Jul, 2020 - Comments: 0

DAC 2020 is like no other Design Automation Conference. It is virtual for this year — and hopefully only this year. The COVID pandemic has proven that face-to-face meetings and conferences are invaluable for many reasons. But with none of the distractions of a traditional conference, focusing on the content was easy. And because the sessions have been pre-recorded, the speakers for each se... » read more

EDA In The Cloud

By Ed Sperling - 18 Feb, 2020 - Comments: 0

Michael White, director of product marketing for Calibre physical verification at Mentor, a Siemens Business, looks at the growing compute requirements at 7, 5 and 3nm, why the cloud looks increasingly attractive from a security and capacity standpoint, and how the cloud as well as new lithography will affect the cost and complexity of developing new chips. » read more

Week In Review: Design, Low Power

By Ed Sperling - 14 Feb, 2020 - Comments: 0

Processors Arm rolled out a micro neural processing unit that, when combined with its newest microcontroller, can increase machine learning performance by up to 480 times. The company is aiming the MCU and co-processor across a wide swath of applications. Worth noting is that Arm calls its Cortex-M55 an AI-capable processor, rather than a microcontroller, as the lines between the various proce... » read more

Week In Review: Design, Low Power

By Jesse Allen - 07 Feb, 2020 - Comments: 0

Presto Engineering, an outsourced operations provider to semiconductor and IoT device manufacturers, acquired the DELTA Microelectronics business unit of FORCE Technology. The acquisition adds DELTA's ASIC design and manufacturing to its portfolio. The two companies will retain a strong relationship: FORCE Technology has become a shareholder of Presto Engineering and Juan Farré, FORCE’s CTO,... » read more

Week In Review: Design, Low Power

By Jesse Allen - 08 Nov, 2019 - Comments: 0

Cadence unveiled a static timing/signal integrity analysis and power integrity analysis tool, Tempus Power Integrity Solution, that integrates the Tempus Timing Signoff and Voltus IC Power Integrity signoff engines. Early use cases demonstrated it correctly identified IR drop errors, avoiding silicon failure prior to tapeout and improving the maximum frequency in silicon by up to 10%. Arasan... » read more

EDA: 8 Consecutive Years Of Growth

By Ann Mutschler - 04 Apr, 2018 - Comments: 0

The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) reported today that revenue for Electronic Design Automation (EDA) industry increased 10.7 percent for Q4 2017 to $2718.6 million, compared to $2455 million in Q4 2016. The four-quarters moving average was up by 9.5 percent. This compares the most recent four quarters to the prior four quarters. "It was a terrific qu... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: EDA industry

Electronic System Design Revenue Up 14.4% Y/Y in Q4 2021

DAC 2020 Day One

EDA In The Cloud

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

EDA: 8 Consecutive Years Of Growth