Changes In Memory Design


An explosion of data in automotive, cloud, and AI are altering the fundamentals of memory design. One size no longer fits all, as memory is used for a broader set of applications, from automotive and cloud to consumer devices. Anand Theruvengadam, director of product management at Synopsys, talks about the impact of big data applications on density, memory stacking, and growing concerns about r... » read more

Challenges Grow For Data Management And Sharing In EDA


Semiconductor Engineering sat down to talk about more openness in EDA data, how increased complexity is affecting time to working silicon, and the impact of geopolitics, with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business U... » read more

Not All There: Heterogeneous Multiprocessor Design Tools


The design, implementation, and programming of multicore heterogeneous systems is becoming more common, often driven by the software workloads, but the tooling to help optimize the processors, interconnect, and memory are disjointed. Over the past few years, many tools have emerged that help with the definition and implementation of a single processor, optimized for a given set of software. ... » read more

Revolutionizing Product Development And User Experience: The Transformative Power Of Generative AI


Generative AI has become a prominent and versatile solution across various domains, including chip and system development. Its progress and impact have outpaced many other technological advancements, significantly benefiting numerous areas. In the semiconductor industry, EDA tools with generative AI have already established their position by offering unparalleled optimization capabilities. Thes... » read more

L31 Embedded Core Extensions For Wireless And Connectivity


5G is the latest generation of cellular networks using the 3rd Generation Partnership Project (3GPP) 5G New Radio air interface. Unlike previous generations of network (2G, 3G & 4G), which had a one-size-fits-all approach, 5G aims to address a wide range of very different applications. To flexibly support diverse quality of service requirements, network slicing is introduced to enable multip... » read more

Smart Manufacturing Makes Gains In Chip Industry


Lights out manufacturing is gaining steam across the semiconductor industry, accelerating productivity, improving quality, and reducing costs and environment impact. These benefits are the result of years of strategic investments in technologies like machine-to-machine communication, data analytics, and robotics to achieve higher levels of autonomy. Semiconductor factories have long depen... » read more

ESD Co-Design For High-Speed SerDeS In FinFET Technologies


An electronic device is susceptible to Electrostatic Discharge (ESD) damage during its entire life cycle, including the phase from the completion of the silicon wafer processing to when the device (die) is assembled in the system. To avoid yield loss due to ESD damage during this early phase, on-chip ESD protection measures are applied to provide a certain degree of ESD robustness. The componen... » read more

Welcome To EDA 4.0 And The AI-Driven Revolution


By Dan Yu, Harry Foster, and Tom Fitzpatrick Welcome to the era of EDA 4.0, where we are witnessing a revolutionary transformation in electronic design automation driven by the power of artificial intelligence. The history of EDA can be delineated into distinct periods marked by significant technological advancements that have propelled faster design iterations, improved productivity, and fu... » read more

Chip Design CEO Outlook


Semiconductor Engineering sat down with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; Dean Drako, president and CEO of IC M... » read more

RL-Guided Detailed Routing Framework for Advanced Custom Circuits


A technical paper titled "Reinforcement Learning Guided Detailed Routing for Custom Circuits" was published by researchers at UT Austin, Princeton University, and NVIDIA. "This paper presents a novel detailed routing framework for custom circuits that leverages deep reinforcement learning to optimize routing patterns while considering custom routing constraints and industrial design rules. C... » read more

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