tag: EDA

Introducing The 55th DAC General Chair
By Sharon Hu - 03 Nov, 2017 - Comments: 0

My first time attending DAC was in 1991, and I am so excited to be serving as the General Chair for the 55th annual conference this June. Coming from academia and meeting new people in the industry sector who have been involved with DAC for years, I thought this to be good opportunity to introduce myself to the entire community. I got my start in engineering as an undergraduate student. Both... » read more

For SoC ISO 26262 Compliance, Should All EDA Tools Be TCL1?
By Mary Ann White - 02 Nov, 2017 - Comments: 2

ISO 26262, the automotive functional safety standard, requires the assessment of software tool confidence levels (TCLs) as either a TCL1, TCL2 or TCL3.  Part 8:2011, clause 11.4.5 of the ISO 26262 standard provides a methodology with guidance for software tool classification and qualification. It applies to software tools used for the development of safety-critical designs where it is essentia... » read more

How To Handle Concurrency
By Brian Bailey - 30 Oct, 2017 - Comments: 3

The evolution of processing architectures has solved many problems within a chip, but for each problem solved another one was created. Concurrency is one of those issues, and it has been getting much more attention lately. While concurrency is hardly a new problem, the complexity of today’s systems is making it increasingly difficult to properly design, implement and verify the software an... » read more

Making Machine Learning Portable
By Ed Sperling - 26 Oct, 2017 - Comments: 0

Machine learning is everywhere, and it has exploded at a pace no one would have expected. Even a year ago, ML was more of an experiment than a reality. NVIDIA's stock price (Fig. 1, below) is a good representation of just how quickly this market has grown. GPUs are the chip of choice for training machine learning systems. Fig. 1: Nvidia 5-year stock price. Source: Google Finance Ma... » read more

How To Build An IoT Chip (Part 2)
By Ed Sperling - 18 Oct, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss IoT chip design issues with Jeff Miller, product marketing manager for electronic design systems in the Deep Submicron Division of [getentity id="22017" e_name="Mentor, a Siemens Business"]; Mike Eftimakis, IoT product manager in [getentity id="22186" e_name="Arm"]'s Systems and Software Group; and John Tinson, vice president of sales at Sondrel Ltd... » read more

Thinking Much Bigger
By Ed Sperling - 28 Sep, 2017 - Comments: 0

For the better part of the past decade the focus has been on integrating an increasing number of smaller components on a piece of silicon. It's time to start thinking much bigger. While there is still plenty of work to be done building more powerful processors, or networks of connected processors on a chip or in a package, new opportunities are opening up in markets such as automotive, medic... » read more

Plugging Gaps In Advanced Packaging
By Ann Mutschler - 27 Sep, 2017 - Comments: 0

The growing difficulty of cramming more features into an SoC is driving the entire chip industry to consider new packaging options, whether that is a more complex, integrated SoC or some type of advanced packaging that includes multiple chips. Most of the work done in this area so far has been highly customized. But as advanced packaging heads into the mainstream, gaps are beginning to appea... » read more

EDA, IP Sales Strong Again
By Ed Sperling - 25 Sep, 2017 - Comments: 0

EDA and IP revenues increased 9.8% to $2.21 billion in Q2, up from $2.01 billion in the same period in 2016, according to just-released statistics from the Electronic System Design (ESD) Alliance. The numbers point to strength in traditional semiconductor markets, as well as growth in new areas and new approaches to chip design. For example, PCB/multi-chip modules revenue was $195.4 million... » read more

Integrated Photonics (Part 3)
By Brian Bailey - 12 Sep, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss the status of integrated photonics with Twan Korthorst, CEO for PhoeniX Software; Gilles Lamant, distinguished engineer for [getentity id="22032" e_name="Cadence"]; Bill De Vries, director of marketing for Lumerical Solutions; and Brett Attaway, director of EPDA solutions at AIM Photonics, SUNY Polytechnic Institute. What follows are excerpts of tha... » read more

Executive Insight: Lip-Bu Tan
By Ed Sperling - 06 Sep, 2017 - Comments: 2

Semiconductor Engineering sat down with Lip-Bu Tan, president and CEO of [getentity id="22032" e_name="Cadence"], to discuss disruptions and changes in the semiconductor industry, from machine learning and advance packaging to tools and business. What follows are excerpts of that conversation. SE: What do you see as the next big thing? Tan: Unlike mobility or cell phones, or PCs before th... » read more

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