Bringing Advanced Semiconductor Manufacturing Technologies To Higher Education

By Jimmy Gu - 17 Nov, 2016 - Comments: 0

Universities and other institutions of higher learning play a key role in developing our next generation of semiconductor technologies. Along with the theory of semiconductor technology, our next generation of scientists and engineers must learn about the practical methods used to design and manufacture the latest generation of semiconductor products. Recently, Coventor’s predictive, 3D proce... » read more

It’s Time To Get Your University In Sync With Zynq

By Aldec - 25 Aug, 2016 - Comments: 0

By Zach Nelson It’s time for universities to say goodbye to their outdated FPGA boards and introduce the Xilinx Zynq chip. The chip is a device which combines an FPGA fabric with a processing unit. The chip is very similar to other FPGA devices, but it does have a few key advantages and features that can enhance your designs and increase its capabilities. What can Zynq do? The Zynq ... » read more

Bridging Hardware And Software

By Ann Mutschler - 28 Apr, 2016 - Comments: 1

The barriers between hardware and software design and verification are breaking down with more intricately integrated systems, bringing together different disciplines and tools. But there are lingering questions about exactly what this shift means design methodologies, team interactions, and what kind of training will be required in the future. Playing heavily into this is the fact that toda... » read more

The Making Of A System Architect

By Sundari Mitra - 24 Mar, 2016 - Comments: 0

I mentor young people from the University of Illinois at Urbana-Champaign, where I got my MSEE. When I talk to them, they tell me they’re applying for chip architecture jobs. But when they graduate with their computer science degrees they all get channeled into verification jobs. Why verification jobs rather than architecture jobs? Because they don’t have a feel for the full architecture. T... » read more

Design Rules Explode At New Nodes

By Ed Sperling - 16 Oct, 2014 - Comments: 0

Semiconductor Engineering sat down changing design rules with Sergey Shumarayev, senior director of custom IP design at Altera; Luigi Capodieci, R&D fellow at [getentity id="22819" comment="GlobalFoundries"]; Michael White, director of product marketing for Calibre Physical Verification at [getentity id="22017" e_name="Mentor Graphics"], and Coby Zelnik, CEO of [getentity id="22478" e_name=... » read more

Ivy League Colleges Crumbling

By Brian Bailey - 24 Apr, 2014 - Comments: 1

Last week I attended a talk from David Pearce Snyder. Snyder is a data-based forecaster, or what some people call a futurist. He has consulted for many Fortune 500 companies and the government. This is part of a lecture series put on by the Institute for Science, Engineering and Public Policy and I got to attend because [getentity id="22017" e_name="Mentor Graphics"] is a sponsor of these talk... » read more

Commoditizing Our Kids

By Jon McDonald - 27 Mar, 2014 - Comments: 0

My son is graduating from high school this year. He’ll be starting on an engineering degree in the fall. Thinking about the outlook he will face reminds me of questions and comments I have received from customers and colleagues at various points. In my mind these thoughts reduce to a simple question: Is engineering skill becoming a commodity? From Wikipedia: “The exact definition of th... » read more

Diverging Viewpoints

By Ed Sperling - 28 Mar, 2013 - Comments: 0

By Ed Sperling The raw materials of semiconductor design include smart, well-trained people and money to fund good ideas from those people, whose backgrounds typically come from engineering, math, physics, computer science, materials science and sometimes even chemistry. While many experts, executives, and industry groups have been sounding the alarm in recent years about everything from la... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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