After years of delays, this next-gen memory is finally gaining traction.

New lithography tools will be required at 5nm, but pellicles, resists and uptime are still problematic.

Computational challenges on the rise with EUV. Scanners are no longer interchangeable.

Industrial IoT now dominates the market, but confusion is still rampant in all sectors.

OneSpin’s CEO looks at what’s needed in this computing space, which technologies are winning, and what the key metrics will be.

Technical issues increase, costs go up, and not all markets will benefit.

Chipmakers wrestle with EOS, ESD and other power-related issues as leading-edge chips are incorporated into industrial and automotive applications.

Advanced packaging shifts to mainstream with complete flows, better tools, market proof points.

There are multiple layers in which machine learning can help with the creation of semiconductors, but getting there is not as simple as for other application areas.

Next-gen embedded memory technology ramps up in wake of flash scaling issues.

Transition from planar to 3D NAND is harder and more time-consuming than expected.

Chipmakers exploring nanosheet, nanoslab, nano-ring and hexagonal FETs.

Funding is free-flowing for the field, but hurdles persist.