The Ideal Solution For AI Applications — Speedcore eFPGAs


AI requires a careful balance of datapath performance, memory latency, and throughput that requires an approach based on pulling as much of the functionality as possible into an ASIC or SoC. But that single-chip device needs plasticity to be able to handle the changes in structure that are inevitable in machine-learning projects. Adding eFPGA technology provides the mixture of flexibility and s... » read more

IP And Power


[getkc id="108" kc_name="Power"] is quickly becoming a major differentiator for products, regardless of whether they are connected to a wall outlet or dependent on a battery. At the same time, increasing amounts of a chips content comes from third-party [getkc id="43" kc_name="IP"]. So how do system designers ensure that the complete system has an optimal power profile, and what can they do to ... » read more

Is Advanced Packaging The Next SoC?


Device scaling appears to be possible down to 1.2nm, and maybe even beyond that. What isn't obvious is when scaling will reach that node, how many companies will actually use it, or even what chips will look like when foundries actually start turning out these devices using multi-patterning with high-NA EUV and dielectrics with single-digit numbers of atoms. There are two big changes playing... » read more

The Week In Review: Design


Startup OnScale launched with advanced CAE multi-physics solvers that are seamlessly integrated with a scalable, high performance cloud computing platform built on Amazon's AWS. The company's model is built around a Solver-as-a-Service pay-as-you-go subscription model and targets 5G, IoT/Industrial IoT, biomedical, and autonomous car markets. The company has $3 million in strategic seed fund... » read more

Embedded FPGA: Increasing Security In Next-Gen Networks


The pull of data toward real-time applications on the network’s edge makes the outflow of processing from the cloud inevitable. Programmable logic provides the ability to make computing much more data-centric. While traditional processors demand data to be fed to their pipelines through a complex hierarchy of memory caches, programmable logic makes it possible to construct data pipelines. Dat... » read more

eFPGA: Think Differently & Experiment


New technologies are never overnight successes and usually develop in new applications. Arm and other embedded processors today are a huge success and pervasive in almost all chips. It took Arm more than five years to win the first five customers. The first applications were not competitive with Intel’s PC dominance but instead filled needs in emerging applications such as mobile phones an... » read more

Tech Talk: On-Chip Variation


Raymond Nijssen, vice president of systems engineering at Achronix, discusses on-chip and process variation at 7nm and 5nm, the role of embedded FPGAs, and how to reduce margin and pessimistic designs. https://youtu.be/LQnw_3H9soQ » read more

The Week In Review: Design


Tools & IP Pro Design launched three new proFPGA Zynq UltraScale+ FPGA modules for SoC and IP prototyping. The modules combine FPGA logic with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors and on-board interfaces. The modules offer a total of up to 5 extension sites with 531 standard I/Os and 16 multi-gigabit transceivers (MGTs). The board allows a maximum point-to-point ... » read more

SoC + AI = SiPx


The market for third-party semiconductor intellectual property (SIP) continues to exhibit growth well beyond the (CAGR) Compound Annual Growth Rate for the semiconductor industry. Semico just completed an in-depth analysis and breakdown of the SIP market in a report called Licensing, Royalty and Service Revenues For 3rd Party SIP (SC105-18). The 2017 to 2022 CAGR is projected to be 10.9%, about... » read more

The Race To Accelerate


Geoff Tate, CEO of [getentity id="22921" e_name="Flex Logix"], sat down with Semiconductor Engineering to discuss how the chip industry is changing, why that bodes well for embedded FPGAs, and what you need to be aware of when using programmable logic on the same die as other devices. What follows are excerpts of that conversation. SE: What are the biggest challenges facing the chip industry... » read more

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