Challenges At The Edge

By Kevin Fogarty - 03 May, 2018 - Comments: 0

By Kevin Fogarty and Ed Sperling Edge computing is inching toward the mainstream as the tech industry begins grappling with the fact that far too much data will be generated by sensors to send everything back to the cloud for processing. The initial idea behind the IoT/IIoT, as well as other connected devices, was that simple sensors would relay raw data to the cloud for processing throug... » read more

AI: The Next Big Thing

By Ed Sperling - 15 Mar, 2018 - Comments: 2

The next big thing isn't actually a thing. It's a set of finely tuned statistical models. But developing, optimizing and utilizing those models, which collectively fit under the umbrella of artificial intelligence, will require some of the most advanced semiconductors ever developed. The demand for artificial intelligence is almost ubiquitous. As with all "next big things," it is a horizonta... » read more

Reflection On 2017: Design And EDA

By Brian Bailey - 03 Jan, 2018 - Comments: 0

People love to make predictions, and most of the time they have it easy, but at Semiconductor Engineering, we ask them to look back on the predictions they make each year and to assess how close to the mark they were. We see what they missed and what surprised them. Not everyone accepts our offer to grade themselves, but most have this year. (Part one looked at the predictions associated with s... » read more

Preparing For Bigger Changes Ahead

By Ed Sperling - 21 Dec, 2017 - Comments: 0

The semiconductor industry has undergone a fundamental shift over the past year, and it's one that will redefine chipmaking over the next decade or more. While the focus is still on building the fastest, lowest-power devices, whether that's by shrinking features or packaging them into blazing-fast 2.5D or fan-out configurations, these devices are being customized for specific use cases much ... » read more

The Limits Of IP Reuse

By Ed Sperling - 07 Sep, 2017 - Comments: 0

The basic business proposition for third-party IP is that it's cheaper, faster, and less problematic to buy rather than build. But things haven't exactly worked out according to plan, either for companies that license IP or those that develop it. For [getkc id="43" kc_name="IP"] licensees, just keeping track of an endless series of updates is becoming unwieldy. Complex designs often include ... » read more

Embedded FPGA — A New System-Level Programming Paradigm

By Achronix - 03 May, 2017 - Comments: 0

The current public debate on the future of the semiconductor industry has turned to discussions about a growing selection of technologies that, rather than obsessing on further process geometry shrinks, focuses instead on new system architectures and better use of available silicon through new concepts in circuit, device, and packaging design. Embedded FPGA is the latest offering that promises ... » read more

Embedded FPGAs Come Of Age

By Ann Mutschler - 27 Feb, 2017 - Comments: 0

FPGAs increasingly are being viewed as a critical component in heterogeneous designs, ratcheting up their stature and the amount of attention being given to programmable devices. Once relegated to test chips that ultimately would be replaced by lower-power and higher-performance ASICs if volumes were sufficient, FPGAs have come a long way. Over the last 20 years programmable devices have mov... » read more

And The Award Goes To…

By Brian Bailey - 22 Nov, 2016 - Comments: 0

I like to look at what users find the most interesting topics, not because it directly influences what I write, but to get a sense of the subjects that are on most people's minds. Some of it comes as no surprise. Content about new fabrication technologies tends to blow everything else away. While it directly affects very few of us, I think we all want to know the general direction of the indust... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: eFPGAs