tag: Eindhoven University of Technology

Technical Paper Round-Up: May 24
By Linda Christensen - 24 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week.   [table id=29 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a ... » read more

Improving Atomic Force Microscopy (AFM)
By Technical Paper Link - 17 May, 2022 - Comments: 0

Research paper "Enhancing sensitivity in atomic force microscopy for planar tip-on-chip probes" from Eindhoven University of Technology, Lorraine University and DRF/IRAMIS/SPEC-LEPO, Centre CEA de Saclay. Abstract "We present a new approach to tuning-fork-based atomic force microscopy for utilizing advanced “tip-on-chip” probes with high sensitivity and broad compatibility. Usually, s... » read more

Blog Review: Oct. 13
By Jesse Allen - 13 Oct, 2021 - Comments: 0

Cadence's Paul McLellan checks out what Google learned in developing multiple generations of its TPU processor, including unequal advancement of logic and memory, the importance of compiler of compatibility, and designing for total cost of ownership. Siemens EDA's Jake Wiltgen argues for the importance of linting as part of eliminating systematic failures in designs complying with ISO 26262.... » read more

Manufacturing Bits: Aug. 24
By Mark LaPedus - 24 Aug, 2021 - Comments: 0

Panel packaging consortium Fraunhofer Institute for Reliability and Microintegration IZM has provided an update on a consortium that is developing panel-level IC packaging technologies. Fraunhofer IZM is leading the consortium. The R&D organization and its partners, including Intel and others, have made progress in terms of equipment, processes and other technologies in the so-called Pa... » read more

Manufacturing Bits: March 23
By Mark LaPedus - 23 Mar, 2021 - Comments: 0

Measuring acceleration The National Institute of Standards and Technology (NIST) has developed a new and better way to measure acceleration. NIST has developed an optomechanical accelerometer, a technology that has more resolution and bandwidth than conventional accelerometers. Optomechanical accelerometers uses laser light of a known frequency to measure acceleration. With the technology, ... » read more

Manufacturing Bits: Aug. 10
By Mark LaPedus - 10 Aug, 2020 - Comments: 0

EUV mask cleaning process TSMC has developed a new dry-clean technology for photomasks used in extreme ultraviolet (EUV) lithography, a move that appears to solve some major problems in the fab. TSMC and Samsung are in production with EUV lithography at advanced nodes, but there are still several challenges with the photomasks and other parts of the technology. Using 13.5nm wavelengths, EUV... » read more

Power/Performance Bits: May 19
By Jesse Allen - 19 May, 2020 - Comments: 0

Neuromorphic magnetic nanowires Researchers from the University of Texas at Austin, University of Texas at Dallas, and Sandia National Laboratory propose a neuromorphic computing method using magnetic components. The team says this approach can cut the energy cost of training neural networks. "Right now, the methods for training your neural networks are very energy-intensive," said Jean Ann... » read more

Power/Performance Bits: May 11
By Jesse Allen - 11 May, 2020 - Comments: 0

Light-emitting silicon Researchers from the Eindhoven University of Technology, Friedrich-Schiller-Universität Jena, Johannes Kepler University, and Technische Universität München developed a silicon germanium alloy that can emit light, paving the way for a silicon laser that could be integrated for on-chip and chip-to-chip communication. Bulk silicon is extremely inefficient at emitting... » read more

COVID-19 Tech Bits
By Linda Christensen - 06 Apr, 2020 - Comments: 0

Tech companies, consortiums and universities are jumping in to help fight COVID-19, deploying everything from massive computing capabilities to developing new technologies that can protect medical workers and first responders. Nearly all of these have ramped up over the past several weeks, as the tech world begins to take on a global challenge to combat the deadly virus. Compute resources... » read more

Manufacturing Bits: Feb. 18
By Mark LaPedus - 18 Feb, 2020 - Comments: 0

Molecular layer etch The U.S. Department of Energy’s Argonne National Laboratory has made new advances in the field of molecular layer etching or etch (MLE). MLE is related to atomic layer etch (ALE). Used in the semiconductor industry, ALE selectively removes targeted materials at the atomic scale without damaging other parts of the structure. ALE is related to atomic layer deposition... » read more

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