Reducing Noise Issues In Microcontroller Systems: Part 1

By Graeme Clark - 22 Jun, 2023 - Comments: 0

In my ideal digital world, of which I often dream, signal voltage margins are always positive, signal timing margins are always positive, power supply voltages are always within the operating voltage range, and our environment is completely benign. Unfortunately, none of us live in this ideal world, no matter how much I would like to. The real world is dirty and noisy, and the power distribu... » read more

EMC Pre-Compliance Fundamentals

By Keysight - 25 Jan, 2023 - Comments: 0

Once you’ve designed your electronic product, it’s time to release it to market, right? Well, not exactly. As with any product development, you need to first test the device you’re designing to validate that it behaves as expected. One such important test that all electronic devices must eventually pass are EMI (electromagnetic interference) compliance tests. Passing EMI tests d... » read more

How To Build A Virtual Electromagnetic Test Environment For Aerospace And Automotive Platforms

By Ansys - 09 Jun, 2021 - Comments: 0

To protect the electromagnetic compatibility (EMC) of complex systems like aircraft and automobiles, you need a full electromagnetic (EM) model. A virtual test environment allows you to assess a design and ensure system-level compatibility before physical testing. This process has been proven to save more than $1 million compared to an approach based solely on testing. Learn how to build a v... » read more

New Issues In Advanced Packaging

By Ann Mutschler - 08 Mar, 2018 - Comments: 1

Advanced packaging is gaining in popularity as the cost and complexity of integrating everything onto a planar SoC becomes more difficult and costly at each new node, but ensuring that these packaged die function properly and yield sufficiently isn't so simple. There are a number of factors that are tilting more of the the semiconductor industry toward advanced [getkc id="27" kc_name="packag... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

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by Brian Bailey

Partitioning In The Chiplet Era

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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tag: electromagnetic compatibility

Reducing Noise Issues In Microcontroller Systems: Part 1

EMC Pre-Compliance Fundamentals

How To Build A Virtual Electromagnetic Test Environment For Aerospace And Automotive Platforms

New Issues In Advanced Packaging