Goals of Going Green

By Anne Meixner - 25 Jul, 2023 - Comments: 0

The chip industry is stepping up efforts to be seen as environmentally friendly, driven by growing pressure from customers and government regulations. Some manufacturers have been addressing sustainability challenges for more than a decade, but they are becoming more aggressive in their efforts, while others are joining them. A review of sustainability reports across the semiconductor indust... » read more

Using ICs To Shrink Auto’s Carbon Footprint

By Ann Mutschler - 03 Dec, 2020 - Comments: 3

A large portion of the burden for reducing greenhouse gases is being handed off to makers of automotive chips and systems, which are being tasked to make vehicles drive further using less energy and with zero emissions. The effort is critical in battling climate change. According to the U.S. Environmental Protection Agency, the transportation sector represented 28.2% of 2018 greenhouse gas e... » read more

Testing For Electromagnetic Compliance Without An Anechoic Chamber

By Paul McLellan - 15 Oct, 2020 - Comments: 0

You can't sell an electronic product without getting CE or FCC (or equivalent) certification. In fact, for medical devices and aerospace, the requirements are even stricter. This doesn't just apply to obvious electronic products like laptops or automotive ECUs (electronic control units). It even applies to household goods like washers and dryers. Furthermore, this isn't just some sort of nice-t... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: emissions

Goals of Going Green

Using ICs To Shrink Auto’s Carbon Footprint

Testing For Electromagnetic Compliance Without An Anechoic Chamber