Benchmarking Electron Holography And Pixelated STEM On Various Semiconductor Structures


A technical paper titled “Measuring electrical properties in semiconductor devices by pixelated STEM and off-axis electron holography (or convergent beams vs. plane waves).” was published by researchers at CEA-LETI at the Universite Grenoble Alpes and EPFL. Abstract: "We demonstrate the use of both pixelated differential phase contrast (DPC) scanning transmission electron microscopy (STEM... » read more

Research Bits: Feb. 6


Laser printer for photonic circuits Researchers from the University of Washington and University of Maryland propose a faster, cheaper way to fabricate and reconfigure photonic integrated circuits. The method uses a laser writer to write, erase, and modify circuits into a thin film of phase-change material similar to what is used for recordable CDs and DVDs. The researcher say the method co... » read more

Chip Industry Technical Paper Roundup: Feb. 6


New technical papers added to Semiconductor Engineering’s library this week. [table id=187 /] More ReadingTechnical Paper Library home » read more

RISC-V Ultra-Low-Power Edge Accelerators (EPFL)


A technical paper titled “X-HEEP: An Open-Source, Configurable and Extendible RISC-V Microcontroller for the Exploration of Ultra-Low-Power Edge Accelerators” was published by researchers at EPFL. Abstract: "The field of edge computing has witnessed remarkable growth owing to the increasing demand for real-time processing of data in applications. However, challenges persist due to limitat... » read more

Research Bits: Jan. 30


Etching tellurite glass Physicists from EPFL and Tokyo Tech propose a way to create photoconductive circuits, where the circuit is directly patterned onto a tellurite glass surface with femtosecond laser light. The exposure formed nanoscale tellurium and tellurium oxide crystals, both semiconducting materials. “Tellurium being semiconducting, based on this finding we wondered if it would ... » read more

Chip Industry Technical Paper Roundup: Jan. 23


New technical papers added to Semiconductor Engineering’s library this week. [table id=189 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Synopsys will acquire Ansys for about $35 billion in cash and stock. The deal will boost Synopsys' multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025. Worldwide semiconductor revenue ... » read more

Security Threats To Multitenant FPGAs: A Remote Undervolting Attack That Activates A Trojan Concealed Within A Victim Design 


A technical paper titled “X-Attack 2.0: The Risk of Power Wasters and Satisfiability Don’t-Care Hardware Trojans to Shared Cloud FPGAs” was published by researchers at EPFL, Cyber-Defence Campus (Switzerland), and Northwestern Polytechnical University (China). Abstract: "Cloud computing environments increasingly provision field-programmable gate arrays (FPGAs) for their programmability ... » read more

Chip Industry’s Technical Paper Roundup: Jan. 8


New technical papers added to Semiconductor Engineering’s library this week. [table id=183 /] More ReadingTechnical Paper Library home » read more

Large-Scale Integration Of 2D Materials As The Semiconducting Channel In An In-Memory Processor (EPFL)


A technical paper titled “A large-scale integrated vector-matrix multiplication processor based on monolayer molybdenum disulfide memories” was published by researchers at École Polytechnique Fédérale de Lausanne (EPFL). Abstract: "Data-driven algorithms—such as signal processing and artificial neural networks—are required to process and extract meaningful information from the mass... » read more

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