Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Synopsys will acquire Ansys for about $35 billion in cash and stock. The deal will boost Synopsys' multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025. Worldwide semiconductor revenue ... » read more

Security Threats To Multitenant FPGAs: A Remote Undervolting Attack That Activates A Trojan Concealed Within A Victim Design 


A technical paper titled “X-Attack 2.0: The Risk of Power Wasters and Satisfiability Don’t-Care Hardware Trojans to Shared Cloud FPGAs” was published by researchers at EPFL, Cyber-Defence Campus (Switzerland), and Northwestern Polytechnical University (China). Abstract: "Cloud computing environments increasingly provision field-programmable gate arrays (FPGAs) for their programmability ... » read more

Chip Industry’s Technical Paper Roundup: Jan. 8


New technical papers added to Semiconductor Engineering’s library this week. [table id=183 /] More ReadingTechnical Paper Library home » read more

Large-Scale Integration Of 2D Materials As The Semiconducting Channel In An In-Memory Processor (EPFL)


A technical paper titled “A large-scale integrated vector-matrix multiplication processor based on monolayer molybdenum disulfide memories” was published by researchers at École Polytechnique Fédérale de Lausanne (EPFL). Abstract: "Data-driven algorithms—such as signal processing and artificial neural networks—are required to process and extract meaningful information from the mass... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Synopsys acquired Imperas, pushing further into the RISC-V world with Imperas' virtual platform technology for verifying and emulating processors. Synopsys has been building up its RISC-V portfolio, starting with ARC-V processor IP and a full suite of tools introduced last month. The first high-NA EUV R&D center in the U.S. will be built at... » read more

Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Liz Allan AMD took the covers off new AI accelerators for training and inferencing of large language model and high-performance computing workloads. In its announcement, AMD focused heavily on performance leadership in the commercial AI processor space through a combination of architectural changes, better software efficiency, along with some improvements in... » read more

Chip Industry Week In Review


By Susan Rambo, Gregory Haley, and Liz Allan Amkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. The first phase of the construction is expected to be completed and operational within two to three years. Synopsys p... » read more

Research Bits: November 21


MoS2 in-memory processor Researchers from École Polytechnique Fédérale de Lausanne (EPFL) developed a large-scale in-memory processor using the 2D semiconductor material, molybdenum disulfide (MoS2), for the channel material in the more than 1,000 transistors that comprise the processor. The MoS2-based in-memory processor is dedicated to vector-matrix multiplication, key for digital signal ... » read more

Chip Industry’s Technical Paper Roundup: October 17


New technical papers added to Semiconductor Engineering’s library this week. [table id=155 /] More Reading Technical Paper Library home » read more

Chip Industry Talent Shortage Drives Academic Partnerships


Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

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