tag: ESD Alliance

Week In Review: Design, Low Power
By Jesse Allen - 17 Aug, 2018 - Comments: 0

Intel disclosed a speculative execution side-channel attack method called L1 Terminal Fault (L1TF). Leslie Culbertson, Intel's executive vice president and general manager of Product Assurance and Security, writes: "This method affects select microprocessor products supporting Intel Software Guard Extensions (Intel SGX) and was first reported to us by researchers at KU Leuven University, Techni... » read more

Big Shifts In Tech Conferences
By Ed Sperling - 16 Aug, 2018 - Comments: 0

By Ed Sperling and Katherine Derbyshire Identifying central themes in technology conferences, or finding enough latitude where the theme is extremely well defined, is becoming challenging throughout the tech industry. Throughout the semiconductor industry, in particular, many are asking how various organizations will differentiate conferences in the future and who will be the target audience... » read more

Week In Review: Design, Low Power
By Jesse Allen - 27 Jul, 2018 - Comments: 0

Tools & IP Cadence uncorked the latest version of the Sigrity signal integrity analysis family of tools, adding a 3D design and 3D analysis environment integrated with Allegro PCB tools that allows users to import mechanical structures, such as cables and connectors, and merge them with the PCB for modeling and optimization as one structure. It also adds full Rigid-Flex PCB extraction from... » read more

EDA, IP Sales Strong Everywhere
By Ed Sperling - 24 Jul, 2018 - Comments: 0

EDA and semiconductor IP sales set new records around the globe, with the Americas passing the $1 billion revenue mark for the first time, according to just-released statistics from the ESD Alliance's Market Statistics Service. Newly compiled numbers for Q1 2018, the latest stats available, show growth in all regions, including Europe and Japan. In fact, the only negative number involved non... » read more

Blog Review: July 11
By Jesse Allen - 11 Jul, 2018 - Comments: 0

Synopsys' Taylor Armerding warns that while significant router vulnerabilities have been known about for years, security mostly hasn't been getting better, leading to a 539% increase in attacks targeting routers since the fourth quarter of 2017. In a video, Mentor's Colin Walls walks through how to deal with the initialization of non-volatile RAM in embedded programming, including suggestion... » read more

CEO Outlook On Chip Industry (Part 3)
By Ed Sperling - 18 Jun, 2018 - Comments: 2

Semiconductor Engineering sat down with Wally Rhines, president and CEO of Mentor, a Siemens Business; Simon Segars, CEO of Arm; Grant Pierce, CEO of Sonics; and Dean Drako, CEO of IC Manage. What follows are excerpts of that conversation. To view part one, click here. Part two is here. L-R: Dean Drako, Grant Pierce, Wally Rhines, Simon Segars. Photo: Paul Cohen/ESD Alliance SE: Securit... » read more

CEO Outlook On Chip Industry (Part 1)
By Ed Sperling - 24 May, 2018 - Comments: 1

Semiconductor Engineering sat down with Wally Rhines, president and CEO of Mentor, a Siemens Business; Simon Segars, CEO of Arm; Grant Pierce, CEO of Sonics; and Dean Drako, CEO of IC Manage. What follows are excerpts of that conversation. L-R: Dean Drako, Grant Pierce, Wally Rhines, Simon Segars. Photo: Paul Cohen/ESD Alliance SE: What are the big changes ahead, and where do you see th... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Apr, 2018 - Comments: 2

Trade The trade tensions are building between the U.S. and China. In the latest move, the U.S. Department of Commerce has imposed a ban on U.S. companies selling chips to ZTE, a Chinese telecom equipment and mobile phone vendor. The ban has been implemented on ZTE for seven years after the firm “was caught illegally shipping U.S. goods to Iran,” according to a report from Reuters. This ... » read more

The Week In Review: Design
By Jesse Allen - 20 Apr, 2018 - Comments: 0

M&A The ESD Alliance is merging with SEMI, becoming a SEMI Strategic Association Partner. SE Editor In Chief Ed Sperling argues that the merger has broad implications for the chip industry, particularly as smaller nodes require greater collaboration between design and manufacturing. Meanwhile, SEMI president and CEO Ajit Manocha explains why the combining will be of benefit to members of b... » read more

Mashup At 7nm
By Ed Sperling - 19 Apr, 2018 - Comments: 0

The merger of two standards organizations typically falls well below the radar of most engineers, but folding the ESD Alliance (formerly known as the EDA Consortium) into SEMI is a different kind of deal. Ever since the introduction of finFETs and multiple patterning, EDA tools have become an integral part of the development of new manufacturing processes. Without those tools, there is no po... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy