Week In Review: Design, Low Power

By Jesse Allen - 27 Jul, 2018 - Comments: 0

Tools & IP Cadence uncorked the latest version of the Sigrity signal integrity analysis family of tools, adding a 3D design and 3D analysis environment integrated with Allegro PCB tools that allows users to import mechanical structures, such as cables and connectors, and merge them with the PCB for modeling and optimization as one structure. It also adds full Rigid-Flex PCB extraction from... » read more

EDA, IP Sales Strong Everywhere

By Ed Sperling - 24 Jul, 2018 - Comments: 0

EDA and semiconductor IP sales set new records around the globe, with the Americas passing the $1 billion revenue mark for the first time, according to just-released statistics from the ESD Alliance's Market Statistics Service. Newly compiled numbers for Q1 2018, the latest stats available, show growth in all regions, including Europe and Japan. In fact, the only negative number involved non... » read more

Blog Review: July 11

By Jesse Allen - 11 Jul, 2018 - Comments: 0

Synopsys' Taylor Armerding warns that while significant router vulnerabilities have been known about for years, security mostly hasn't been getting better, leading to a 539% increase in attacks targeting routers since the fourth quarter of 2017. In a video, Mentor's Colin Walls walks through how to deal with the initialization of non-volatile RAM in embedded programming, including suggestion... » read more

CEO Outlook On Chip Industry (Part 3)

By Ed Sperling - 18 Jun, 2018 - Comments: 2

Semiconductor Engineering sat down with Wally Rhines, president and CEO of Mentor, a Siemens Business; Simon Segars, CEO of Arm; Grant Pierce, CEO of Sonics; and Dean Drako, CEO of IC Manage. What follows are excerpts of that conversation. To view part one, click here. Part two is here. L-R: Dean Drako, Grant Pierce, Wally Rhines, Simon Segars. Photo: Paul Cohen/ESD Alliance SE: Securit... » read more

CEO Outlook On Chip Industry (Part 1)

By Ed Sperling - 24 May, 2018 - Comments: 1

Semiconductor Engineering sat down with Wally Rhines, president and CEO of Mentor, a Siemens Business; Simon Segars, CEO of Arm; Grant Pierce, CEO of Sonics; and Dean Drako, CEO of IC Manage. What follows are excerpts of that conversation. L-R: Dean Drako, Grant Pierce, Wally Rhines, Simon Segars. Photo: Paul Cohen/ESD Alliance SE: What are the big changes ahead, and where do you see th... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 20 Apr, 2018 - Comments: 2

Trade The trade tensions are building between the U.S. and China. In the latest move, the U.S. Department of Commerce has imposed a ban on U.S. companies selling chips to ZTE, a Chinese telecom equipment and mobile phone vendor. The ban has been implemented on ZTE for seven years after the firm “was caught illegally shipping U.S. goods to Iran,” according to a report from Reuters. This ... » read more

The Week In Review: Design

By Jesse Allen - 20 Apr, 2018 - Comments: 0

M&A The ESD Alliance is merging with SEMI, becoming a SEMI Strategic Association Partner. SE Editor In Chief Ed Sperling argues that the merger has broad implications for the chip industry, particularly as smaller nodes require greater collaboration between design and manufacturing. Meanwhile, SEMI president and CEO Ajit Manocha explains why the combining will be of benefit to members of b... » read more

Mashup At 7nm

By Ed Sperling - 19 Apr, 2018 - Comments: 0

The merger of two standards organizations typically falls well below the radar of most engineers, but folding the ESD Alliance (formerly known as the EDA Consortium) into SEMI is a different kind of deal. Ever since the introduction of finFETs and multiple patterning, EDA tools have become an integral part of the development of new manufacturing processes. Without those tools, there is no po... » read more

Joining Hands In The Semiconductor Industry

By Ajit Manocha - 19 Apr, 2018 - Comments: 0

SEMI’s mantra is: Connect, Collaborate, Innovate. This mantra has delivered industry-enabling value to our members since SEMI’s beginnings in 1970. It has been essential for SEMI members to grow and prosper locally, while being synchronized globally. As the electronics manufacturing business has become more complex and interdependent, SEMI’s mantra has increasingly been applied across the... » read more

SEMI Merges With ESD Alliance

By Ed Sperling - 16 Apr, 2018 - Comments: 2

SEMI unveiled plans today to merge with the ESD Alliance, the chip industry's top EDA tools group, following three similar moves by SEMI in other slices of the semiconductor supply chain. The consolidation among industry groups began several years ago, but it has accelerated recently with the rollup under SEMI's leadership of the FlexTech Alliance, the MEMS & Sensors Industry Group and the F... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ESD Alliance