Moore’s Law Debate Continues

By Ann Mutschler - 02 Nov, 2016 - Comments: 0

Does shrinking devices still make sense from a cost and performance perspective? The answer isn’t so simple anymore. Still, the discussion as to whether semiconductors are still on track with [getkc id="74" comment="Moore's Law"] occurs on a frequent enough basis to continue analyzing at least some of the dynamics at play. There is much speculation about what happens after 7nm, as well as ... » read more

Silicon Photonics Comes Into Focus

By Ed Sperling - 31 Oct, 2016 - Comments: 5

Silicon photonics is attracting growing attention and investment as a companion technology to copper wiring inside of data centers, raising new questions about what comes next and when. Light has always been the ultimate standard for speed. It requires less energy to move large quantities of data, generates less heat than electricity, and it can work equally well over long or short distances... » read more

IoT – And A Tear In The Fabric Of The Connected World

By Mike Gianfagna - 27 Oct, 2016 - Comments: 0

Billions of connected things. Massive silicon consumption. Exponentially rising data volumes. Global compute farm build-out to make sense out of all of it. Lots of dollar signs. Everyone is talking about IoT with an optimistic view toward the future. There is a dark side to all this. Many, including yours truly have written about it. If you’re familiar with the Terminator series, you can call... » read more

Find The Best IP For You

By eSilicon - 26 Oct, 2016 - Comments: 0

It can be quite challenging and time consuming to find the right semiconductor IP for your project. You’ve got to find IP that does not consume too much power, meets your performance target, has the lowest leakage when your product goes on standby, and last but not least, IP that occupies the least amount of expensive real estate on your chip. How can you accomplish such a task without having... » read more

2.5D Surprises And Alternatives

By Ed Sperling - 20 Oct, 2016 - Comments: 0

Semiconductor Engineering sat to discuss advanced packaging issues with Juan Rey, senior director of engineering for Calibre at [getentity id="22017" e_name="Mentor Graphics"]; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; and Lisa Minwell, [getentity id="22242" e_name="eSilicon's"] senior director of IP marketing. What follows are excerpts of that conversation. ... » read more

What Can Go Wrong In Automotive

By Ed Sperling - 06 Oct, 2016 - Comments: 1

Semiconductor Engineering sat down to discuss automotive engineering with Jinesh Jain, supervisor for advanced architectures in Ford’s Research and Innovation Center in Palo Alto; Raed Shatara, market development for automotive infotainment at [getentity id="22331" comment="STMicroelectronics"]; Joe Hupcey, verification product technologist at [getentity id="22017" e_name="Mentor Graphics"]; ... » read more

Building Chips That Can Learn

By Ed Sperling - 29 Sep, 2016 - Comments: 0

The idea that devices can learn optimal behavior rather than relying on more generalized hardware and software is driving a resurgence in artificial intelligence, machine leaning, and cognitive computing. But architecting, building and testing these kinds of systems will require broad changes that ultimately could impact the entire semiconductor ecosystem. Many of these changes are wel... » read more

Designers: Take Control Of Your Chip

By Mike Gianfagna - 29 Sep, 2016 - Comments: 0

This is a familiar story for us – maybe it is for you, too. From time to time, a customer contacts us and says they have a design in mind, but they just can’t fit in the package, or meet the power budget, or meet timing. Fifty percent or more of the area for many of the chips we see is composed of memory. So we start there. After a Pareto analysis of the memory sub-system, we typically find... » read more

The Week In Review: Design

By Jesse Allen - 23 Sep, 2016 - Comments: 0

Tools Real Intent updated its Ascent Lint product, adding 50 new customer-driven rules, improved support of VHDL and System Verilog, and a new database-driven debugger with an integrated source browser and improved schematic visualization. IP ARM launched a new real-time processor with advanced safety features for autonomous vehicles and medical and industrial robots. The processor, Co... » read more

Plugging Holes In Machine Learning

By Ed Sperling - 19 Sep, 2016 - Comments: 0

The number of companies using machine learning is accelerating, but so far there are no tools to validate, verify and debug these systems. That presents a problem for the chipmakers and systems companies that increasingly rely on machine learning to optimize their technology because, at least for now, it creates the potential for errors that are extremely difficult to trace and fix. At the s... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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