Week In Review: Auto, Security, Pervasive Computing

By Linda Christensen - 19 May, 2023 - Comments: 0

Former Apple engineer Weibao Wang was indicted for stealing Apple’s autonomous vehicle hardware and software IP and giving the information to Chinese competitors. Among other items, authorities said they found source code for the project on the engineer’s personal laptop, which was seized at his home. Wang fled to China the same day a search warrant was executed. This is one of five cases b... » read more

Chip Industry’s Technical Paper Roundup: May 16

By Linda Christensen - 16 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=103 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Quantum: Loophole-Free Bell Test with Superconducting Circuits (ETH Zurich)

By Technical Paper Link - 10 May, 2023 - Comments: 0

A new technical paper titled "Loophole-free Bell inequality violation with superconducting circuits" was published by a group of researchers led by ETH Zurich. Abstract (partial) "Here we demonstrate a loophole-free violation of Bell’s inequality with superconducting circuits, which are a prime contender for realizing quantum computing technology. To evaluate a Clauser–Horne–Shimony... » read more

Chip Industry’s Technical Paper Roundup: Apr. 25

By Linda Christensen - 25 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=94 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

CAN Bus Security Using TDCs (ETH Zurich & CISPA Helmholtz Center)

By Technical Paper Link - 21 Apr, 2023 - Comments: 0

A technical paper titled "EdgeTDC: On the Security of Time Difference of Arrival Measurements in CAN Bus Systems" was published by researchers at ETH Zurich and CISPA Helmholtz Center for Information Security. Abstract "A Controller Area Network (CAN bus) is a message- based protocol for intra-vehicle communication designed mainly with robustness and safety in mind. In real-world deployment... » read more

State of the Art And Future Directions of Rowhammer (ETH Zurich)

By Technical Paper Link - 18 Apr, 2023 - Comments: 0

A new technical paper titled "Fundamentally Understanding and Solving RowHammer" was published by researchers at ETH Zurich. Abstract "We provide an overview of recent developments and future directions in the RowHammer vulnerability that plagues modern DRAM (Dynamic Random Memory Access) chips, which are used in almost all computing systems as main memory. RowHammer is the phenomenon in... » read more

Chip Industry’s Technical Paper Roundup: Apr. 18

By Linda Christensen - 18 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=93 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involv... » read more

Scalable, Shared-L1-Memory Manycore RISC-V System

By Technical Paper Link - 10 Apr, 2023 - Comments: 0

A new technical paper titled "MemPool: A Scalable Manycore Architecture with a Low-Latency Shared L1 Memory" was published by researchers at ETH Zurich and University of Bologna. Abstract: "Shared L1 memory clusters are a common architectural pattern (e.g., in GPGPUs) for building efficient and flexible multi-processing-element (PE) engines. However, it is a common belief that these tightly... » read more

Chip Industry’s Technical Paper Roundup: Apr. 10

By Linda Christensen - 10 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=92 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Low-Power Heterogeneous Compute Cluster For TinyML DNN Inference And On-Chip Training

By Technical Paper Link - 09 Apr, 2023 - Comments: 0

A new technical paper titled "DARKSIDE: A Heterogeneous RISC-V Compute Cluster for Extreme-Edge On-Chip DNN Inference and Training" was published by researchers at University of Bologna and ETH Zurich. Abstract "On-chip deep neural network (DNN) inference and training at the Extreme-Edge (TinyML) impose strict latency, throughput, accuracy, and flexibility requirements. Heterogeneous clus... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ETH Zurich