tag: EUV

3D Effects At 20nm And Beyond
By Ann Mutschler - 19 Mar, 2015 - Comments: 0

At the 20nm process node and below, attenuated phase shift masks (PSM) are used in the photolithography process, which results in approximately 70nm of topography. This now must be accounted for using 3D mask approximation. Aki Fujimura, CEO of [getentity id="22864" comment="D2S"], explained that in terms of [getkc id="80" comment="lithography"], where simulation-based technologies are used,... » read more

Challenges Mount For Patterning And Masks
By Mark LaPedus - 19 Mar, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss lithography and photomask trends with Uday Mitra, vice president and chief technology officer for the Etch Business Unit at [getentity id="22817" e_name="Applied Materials"]; Pawitter Mangat, senior manager and deputy director for EUV lithography at [getentity id="22819" comment="GlobalFoundries"]; Aki Fujimura, chief executive at [getentity id="228... » read more

5 Issues Under The SPIE Radar
By Mark LaPedus - 19 Mar, 2015 - Comments: 0

As usual, the recent SPIE Advanced Lithography Conference was a busy, if not an overwhelming, event. At the event, there were endless presentations on the usual subjects, such as design, patterning, metrology and photoresists. And as in past years, one left the event with more questions than answers. At this year’s event, the most obvious question was (and still is) clear: Will extreme ult... » read more

Issues And Options At 5nm
By Mark LaPedus - 19 Mar, 2015 - Comments: 0

While the foundries are ramping up their processes for the 16nm/14nm node, vendors are also busy developing technologies for 10nm and beyond. In fact, chipmakers are finalizing their 10nm process offerings, but they are still weighing the technology options for 7nm. And if that isn’t enough, IC makers are beginning to look at the options at 5nm and beyond. Today, chipmakers can see a p... » read more

Manufacturing Bits: March 17
By Mark LaPedus - 17 Mar, 2015 - Comments: 0

EUV source firm seeks help In 2012, a startup called Zplasma came out of stealth mode and introduced its first technology—a next-generation power source for extreme ultraviolet (EUV) lithography. But after much fanfare and hope, Zplasma has been unable to commercialize its EUV source technology. The company has also been unable to attract a development partner or outside funding. And t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Mar, 2015 - Comments: 0

EUV lithography remains a mixed bag, according to analysts. "We are downgrading shares of ASML to 'Sector Perform' from 'Outperform' as we think shares appear fully valued based on midterm lithography demand and our view that meaningful EUV adoption is still several years out," said Weston Twigg, an analyst with Pacific Crest Securities, in a new report. "We think the reality is that it is not ... » read more

More Lithography Options?
By Mark LaPedus - 03 Mar, 2015 - Comments: 1

Lithographers face some tough decisions at 10nm and beyond. At these nodes, IC makers are still weighing the various patterning options. And to make it even more difficult, lithographers could soon have some new, and potentially disruptive, options on the table. On one front, the traditional next-generation lithography (NGL) technologies are finally making some noticeable progress. For examp... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Feb, 2015 - Comments: 0

At the SPIE Advanced Lithography conference in San Jose, Calif., there were several takeaways. First, the battle for lithography share is heating up at Intel. “We believe Nikon still holds a decent position at Intel, but with ASML gaining some share at 10nm. Nikon could regain some share with its new platform at 7nm, in our view, but it is early to tell. We believe Nikon has improved its posi... » read more

Extra! Extra! Read All About It!
By Marc David Levenson - 26 Feb, 2015 - Comments: 1

ASML announced that they are going into the pellicle business at 2:15pm on February 25 at the SPIE Advanced Lithography Symposium in San Jose. These are not your garden variety plastic membrane pellicles, mind you, but rather EUV pellicles made out of 50nm thick polysilicon film and stretched on frames that can be attached, removed and reattached on EUV masks. Dr. Carmen Zoldesi of ASML reveal... » read more

Manufacturing Bits: Feb. 24
By Mark LaPedus - 24 Feb, 2015 - Comments: 0

EUV progress report At the SPIE Advanced Lithography conference in San Jose, Calif., ASML Holding said that one customer, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), has exposed more than 1,000 wafers on an NXE:3300B EUV system in a single day. This is one step towards the insertion of EUV lithography in volume production. During a recent test run on the system, TSMC exposed 1,022 w... » read more

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