Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 01 Sep, 2023 - Comments: 0

The U.S. Department of Energy (DOE) announced $15.5 billion in funding and loans for retooling existing automotive factories for the transition to electric vehicles (EVs) and supporting local jobs, plus a notice of intent for $3.5 billion in funding to expand domestic manufacturing of batteries for EVs and the nation’s grid, and for battery materials and components that are currently imported... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing

By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Will Big Competition Attract More Talent For IC Companies?

By Marie C. Baca - 26 May, 2022 - Comments: 1

Google is hiring a chip packaging technologist. General Motors is seeking a wafer fabrication procurement specialist. Facebook Reality Labs wants a materials researcher with experience in photolithography and nanoimprint techniques. Recent job postings by tech and automotive giants are enough to worry any chip company executive struggling to attract talent. But what may seem at first like a ... » read more

Data Center Architectures In Flux

By Ann Mutschler - 24 Feb, 2022 - Comments: 0

Data center architectures are becoming increasingly customized and heterogeneous, shifting from processors made by a single vendor to a mix of processors and accelerators made by multiple vendors — including system companies' own design teams. Hyperscaler data centers have been migrating toward increasingly heterogeneous architectures for the past half decade or so, spurred by the rising c... » read more

Why Data Center Power Will Never Come Down

By Bryon Moyer - 10 Feb, 2022 - Comments: 3

Data centers have become significant consumers of energy. In order to deal with the proliferation of data centers and the servers within them, there is a big push to reduce the energy consumption of all data center components. With all that effort, will data center power really come down? The answer is no, despite huge improvements in energy efficiency. “Keeping data center power consum... » read more

Will Markets For ML Models Materialize?

By Bryon Moyer - 02 Dec, 2021 - Comments: 0

Developers are spending increasing amounts of time and effort in creating machine-learning (ML) models for use in a wide variety of applications. While this will continue as the market matures, at some point some of these efforts might be seen as reinventing models over and over. Will developers of successful models ever have a marketplace in which they can sell those models as IP to other d... » read more

Reviving The IPO Route For IP Companies

By Ed Sperling - 01 Nov, 2021 - Comments: 0

K. Charles Janac, chairman and CEO of Arteris IP, sat down with Semiconductor Engineering to talk about the company's recent decision to go public, including the benefits and risks of operating as a public IP company. SE: The rule of thumb used to be $20 million in revenue was needed for an IP company to do an IPO at the turn of the Millennium, and then it increased to $40 million about a de... » read more

Get Ready For The Next Generation Of Wearable Tech

By Brian Bailey - 18 Oct, 2021 - Comments: 0

Wearables have attracted a lot of attention recently, due to both their successes as well as failures. They bring together requirements for packaging, new substrates, power scavenging, low-power, novel connectivity, flexibility, durability, as well as fashion. While some of the challenges remain formidable, the long-term potential is driving the industry to look at what is possible. They are... » read more

Microelectronics And The AI Revolution

By Frank Schirrmeister - 23 Sep, 2021 - Comments: 0

It is no secret that artificial intelligence and machine learning (AI/ML) are critical drivers for growth in electronics, and particularly, for semiconductors. The recent AI Hardware Summit showcased trends in AI/ML, both in enabling and using it in various application domains, including EDA. As part of the summit, Imec had organized a panel on “Advanced Microelectronics Technologies Driving ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 10 Sep, 2021 - Comments: 0

Chipmakers, OEMs Intel plans to establish foundry capacity at its fab in Ireland. The company has also launched the so-called Intel Foundry Services Accelerator to help automotive chip designers transition from mature to advanced nodes. The company is setting up a new design team and offering both custom and industry-standard intellectual property (IP) to support the needs of automotive custom... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?