AI Process Control Platform Enabling Next Generation Technology


PAICe Monitor delivers AI and machine learning-enabled analytics for all stages of the semiconductor fabrication process lifecycle — from process development and ramp readiness, to high volume production. Leveraging Tignis’ Digital Twin Query Language, PAICe Monitor enables process engineers to transform in-product fault diagnoses into continuous real-time monitoring—greatly improving ... » read more

Maintaining Vehicles Of The Future


Driving a scalable, consumer-centric vision in the mobility industry, vehicles of thefuture will always be connected and differentiated by software. Advancements in software, hardware and their interaction are expanding the boundaries of performance, providing the foundation for next-generation cars. But the same technology that will make this vision a reality also presents new challenges. O... » read more

Similar But Different — The Tale Of Transient And Permanent Faults


When determining whether an IC is safe from random hardware faults, applying safety metrics such as PMHF, SPFM, and LFM, engineers must analyze both transient and permanent faults. This paper highlights the fundamental differences between permanent and transient faults on digital circuits, and why this distinction is important in the context of the ISO 26262:2018 functional safety standard. ... » read more

Orchestrating An Efficient ISO 26262 Fault Campaign


The primary objective of a fault campaign is to understand whether the safety architecture sufficiently prevents random failures from violating ISO 26262 safety requirements for both commercial and passenger automobiles. To complete fault injection, faults are injected and propagated in the design to validate the functional correctness of the safety mechanisms and to classify each fault. Fault ... » read more

Automation And Fault Simulation Of Safety-Critical FPGA Designs


Functional safety is a major challenge for field programmable gate arrays (FPGAs) and other semiconductor designs. Safety requirements go beyond traditional verification, which focuses on design bugs. Chips in safety-critical applications must be able to handle a variety of faults from sources such as temperature and power extremes, device aging, radiation, ionization and component failures. Ap... » read more