tag: finFET

Moore’s Law: A Status Report
By Ed Sperling - 20 Apr, 2017 - Comments: 3

Moore's Law has been synonymous with "smaller, faster, cheaper" for the past 52 years, but increasingly it is viewed as just one of a number of options—some competing, some complementary—as the chip industry begins zeroing in on specific market needs. This does not make [getkc id="74" comment="Moore's Law"] any less relevant. The number of companies racing from 16/14nm to 7nm is higher t... » read more

OSAT Biz: Growth And Challenges
By Mark LaPedus - 08 Feb, 2017 - Comments: 0

Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

Design Convergence For 7nm Chips Needs Big Data-Driven Multi-Physics Optimization
By Scott Johnson - 08 Dec, 2016 - Comments: 0

Advancements in silicon process technologies are enabling companies to deliver products with faster performance, lower power and greater functionality. These benefits are especially attractive for chip manufacturers servicing markets such as high-end mobile and enterprise computing. However, the cost in terms of both dollars and resources associated with bringing 7-nanometer (nm) finFET-based s... » read more

And The Award Goes To…
By Brian Bailey - 22 Nov, 2016 - Comments: 0

I like to look at what users find the most interesting topics, not because it directly influences what I write, but to get a sense of the subjects that are on most people's minds. Some of it comes as no surprise. Content about new fabrication technologies tends to blow everything else away. While it directly affects very few of us, I think we all want to know the general direction of the indust... » read more

7nm Power Issues And Solutions
By Preeti Gupta - 16 Nov, 2016 - Comments: 0

Being able to achieve 35% speed improvement, 65% power reduction and 3.3X higher density makes adopting a 7nm process for your next system-on-chip (SoC) design seem like an easy decision. However, with $271 million in estimated total design cost and 500 man-years it would take to bring a mid-range 7nm SoC to production, companies need to carefully weigh the benefits against the cost of designin... » read more

10nm FinFET Market Heats Up
By Mark LaPedus - 16 Oct, 2016 - Comments: 1

The 10nm finFET market is heating up in the foundry business amid the ongoing push to develop chips at advanced nodes. Not long ago, Intel announced its 10nm finFET process, with plans to ramp up the technology in 2017. Then, TSMC recently introduced its 10nm process, with plans to move into production by the fourth quarter of 2016. Now, Samsung Electronics said that it has commenced mass... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Sep, 2016 - Comments: 0

Chipmakers The finFET market is heating up. GlobalFoundries, Intel, Samsung and TSMC are ramping 16nm/14nm finFETs. And 10nm and 7nm finFETs are in the works. The market will shortly have a new competitor—Taiwan’s United Microelectronics Corp. (UMC). Some years ago, UMC licensed finFET technology from IBM. UMC has been a bit quiet about the 14nm finFET technology, but it has made si... » read more

Fins And Wires – How Do We Get To 5nm?
By Mike Chudzik - 18 Aug, 2016 - Comments: 0

As the industry moves beyond 10nm to the 7nm and 5nm nodes, fundamental shifts are needed to address scaling challenges. Among the priority concerns driving industry changes, particularly with respect to materials and architecture, is the impact on transistor performance from rising parasitic resistance and parasitic capacitance or RC. I spoke about this industry dilemma recently at the SEMICON... » read more

What Transistors Will Look Like At 5nm
By Mark LaPedus - 18 Aug, 2016 - Comments: 3

Chipmakers are currently ramping up 16nm/14nm finFET processes, with 10nm and 7nm just around the corner. The industry also is working on 5nm. TSMC hopes to deliver a 5nm process by 2020. GlobalFoundries, Intel and Samsung are doing R&D for that node. But 5nm technology presents a multitude of unknowns and challenges. For one thing, the exact timing and specs of 5nm remain cloudy. The... » read more

Optical Metrology Solutions For 10nm Films Process Control Challenges
By KLA - 17 Aug, 2016 - Comments: 0

By Sridhar Mahendrakar (a), Alok Vaida (a), Kartik Venkataraman (b), Michael Lenahan (a), Steven Seipp (a), Fang Fanga (a), Shweta Saxena (a), Dawei Hu (b), Nam Hee Yoon (b), Da Song (b), Janay Camp (b), Zhou Ren (b). [a: GlobalFoundries; b:KLA-Tencor] Controlling thickness and composition of gate stack layers in logic and memory devices is critical to ensure transistor performance meets r... » read more

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