Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science


Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more

Life on the Edge of IoT


The world on the edge of the IoT provides a rich microcosm to explore. While much of the attention paid to IoT is on big data applications in the cloud or the world of aggregating massive data provided by the real-world edge devices in the wild though cellphones and gateways, the edge devices themselves present a cornucopia of design challenges and exciting applications. Sensors and actuators m... » read more

The Evolving Thermal Landscape


Managing heat in chips is becoming a precision balancing act at advanced nodes and with advanced packaging. While it's important to ensure that temperatures don't rise high enough to cause reliability problems, adding too much circuitry to control heat can reduce performance and lower energy efficiency. The most common approach to dealing with these issues is thermal simulation, which requir... » read more