tag: finite element analysis

Beating The Heat In 3D Packages
By Laura Peters - 25 Mar, 2026 - Comments: 0

Key Takeaways: Thermal management is a central design constraint, requiring early, thorough planning. Accurate thermal simulation requires AI-driven adaptive meshing and real-world validation. Innovative STCO strategies can drastically reduce GPU peak temperature. As HPC and AI accelerators push power densities to 1kW and beyond, the heat generated by rapidly switching tran... » read more

Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)
By Technical Paper Link - 06 Jan, 2026 - Comments: 0

A new technical paper titled "Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning" was published by researchers at University of Ottawa. Abstract "Advanced 2.5D flip-chip packages with silicon/glass interposers may pose tightly coupled thermo-mechanical trade-offs. This work presents a simulation-driven, ... » read more

3D-IC Stress Analysis
By Shetha Nolke - 08 Jul, 2025 - Comments: 0

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional density, a smaller footprint and enhanced system performance. However, these same innovations introduce new mechanical stressors within complex assemblies, posing novel reliability risks across the dev... » read more

Defect Analysis and Testing Framework For FOWLP Interconnects
By Technical Paper Link - 24 Mar, 2025 - Comments: 0

A new technical paper titled "Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging" was published by researchers at Arizona State University. Abstract "Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. However, FOWLP fa... » read more

Powering Mechanical Simulations: AMD Vs. Intel
By Wim Slagter - 14 Nov, 2024 - Comments: 0

When selecting the right central processing unit (CPU) for optimizing Ansys Mechanical structural finite element analysis (FEA) software performance, there are two major players to consider: Intel and AMD. Both have made significant advancements in recent years, but choosing between them depends on several factors that directly affect simulation speeds, scalability, and overall performance fo... » read more

Cloud Or On-premises? Why Not Both: A Hybrid Approach For Structure Simulation
By Thomas Lejeune - 17 Oct, 2024 - Comments: 0

Faced with large problem sizes and urgent deadlines, it’s not surprising that more and more product development teams are accessing high-performance computing (HPC) resources on the cloud. After all, a cloud computing model enables you to access the most advanced, leading-edge software and hardware on demand. There are no queues or wait times. Users can “dial up” core counts and other set... » read more

Predicting Warpage in Different Types of IC Stacks At Early Stage Of Package Design
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A new technical paper titled "Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects" was published by researchers at Siemens EDA, D2S, and Univ. Grenoble Alpes, CEA, Leti. Abstract: "A physics-based multi-scale simulation methodology that analyses die stress variations generated by package fabrication is employed for warpage study. The ... » read more

Revving Up SiC And GaN
By Ann Mutschler - 13 Dec, 2021 - Comments: 0

Silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular for power electronics, particularly in automotive applications, driving down costs as volumes scale up and increasing the demand for better tools to design, verify, and test these wide-bandgap devices. Both SiC and GaN are proving essential in areas such as battery management in electric vehicles. They can handle much ... » read more

Computational Software: The Foundation Across Software Disciplines
By Frank Schirrmeister - 30 Jul, 2020 - Comments: 0

You may have seen the term "computational software" more often recently. What are some prominent examples? Why do we in the electronic design automation (EDA) industry have to deal with math in the first place? Wasn't chip design all about drawing polygons at one point? I’m glad you asked! Computational software supports and manages the complexity of fundamental industry trends—hyperscal... » read more

Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science
By Kim Yess - 10 Sep, 2018 - Comments: 0

Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more

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