The Race Toward Mixed-Foundry Chiplets

By Ann Mutschler - 23 Mar, 2023 - Comments: 1

Creating chiplets with as much flexibility as possible has captured the imagination of the semiconductor ecosystem, but how heterogeneous integration of chiplets from different foundries will play out remains unclear. Many companies in the semiconductor ecosystem are still figuring out how they will fit into this heterogeneous chiplet world and what issues they will need to solve. While near... » read more

Week In Review: Auto, Security, Pervasive Computing

By Linda Christensen - 10 Mar, 2023 - Comments: 0

Rambus will begin selling Arm's CryptoCell embedded security platform and CryptoIsland root-of-trust cores, setting the stage for a much broader push by Rambus into security for a wide range of connected devices, and ultimately into security as a service. Under the terms of the deal, Rambus' customers will be able to license Arm IP directly from Rambus. For Arm's existing customers, there will ... » read more

The Importance Of Metal Stack Compatibility For Semi IP

By Geoff Tate - 02 Mar, 2023 - Comments: 0

Every foundry and every node is different, but for every foundry/node there are multiple supported metal stacks. Some chips use a lot more metal layers than others. A common rule of thumb is each metal layer increases wafer cost 10%. So, a chip with 5 more metal layers than another will cost 50%+ more. The most complex, high performance chips, including performance FPGAs, typically use AL... » read more

How To Build Resilience Into Chips

By Ed Sperling and Ann Mutschler - 27 Feb, 2023 - Comments: 0

Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for continued improvements in performance and power, but it's also contributing to unusual and often unpredictable errors in hardware that are extremely difficult to find. The sources of those errors can include anything from timing errors in a particular sequence, to gaps in bonds between chi... » read more

Dealing With Performance Bottlenecks In SoCs

By Brian Bailey - 23 Feb, 2023 - Comments: 0

A surge in the amount of data that SoCs need to process is bogging down performance, and while the processors themselves can handle that influx, memory and communication bandwidth are straining. The question now is what can be done about it. The gap between memory and CPU bandwidth — the so-called memory wall — is well documented and definitely not a new problem. But it has not gone away... » read more

Safety, Security, And Reliability Of AI In Autos

By Ed Sperling - 22 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about security, aging, and safety in automotive AI systems, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which was held in front of a live audience at DesignCon. Part one of this discussion is he... » read more

AI’s Impact In Automobiles Remains Uncertain

By Ed Sperling - 15 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about software updates in cars, where AI makes sense, and why there's a growing sense of optimism, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which were held in front of a live audience at Desi... » read more

Where And Why AI Makes Sense In Cars

By Ed Sperling - 02 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about where AI makes sense in automotive and what are the main challenges, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which were held in front of a live audience at DesignCon. Part two of this... » read more

Micro FPGAs And Embedded FPGAs

By Geoff Tate - 02 Feb, 2023 - Comments: 0

When people hear “FPGA” they think “big, expensive, power hungry.” But it doesn’t need to be that way. Renesas has announced their Forge FPGA family. Details are at their website and in one of the many articles that covered their press release. Forge FPGAs show that FPGAs don’t have to be big, power hungry, and expensive. Forge FPGAs are tiny, draw standby current measure... » read more

Improving PPA When Embedding FPGAs Into SoCs

By Ed Sperling - 31 Jan, 2023 - Comments: 0

Embedded FPGAs have been on everyone’s radar for years as a way of extending the life of chips developed at advanced nodes, but they typically have come with high performance and power overhead. That’s no longer the case, and the ability to control complex chips and keep them current with changes to algorithms and various protocols is significant step. Geoff Tate, CEO of Flex Logix, talks a... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Flex Logix