tag: FormFactor

Improving Wafer-Level S-Parameters Measurement Accuracy And Stability With Probe-Tip Power Calibration Up To 110 GHz For 5G Applications
By FormFactor - 09 Mar, 2020 - Comments: 0

Author: Choon Beng Sia, FormFactor Inc., Singapore Demands for mission critical wireless services such as autonomous driving and telehealth require higher data transfer rates and lower latencies. Such applications are now driving the use of radio frequencies (RF) at 28, 38, 60 and 73 GHz for the emerging 5G mobile communication systems. Waferlevel RF measurements of devices or circuits for 5... » read more

Chiplet Momentum Rising
By Mark LaPedus - 26 Feb, 2020 - Comments: 0

The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Feb, 2020 - Comments: 0

Fab tools The United States is mulling over new trade export restrictions for U.S. fab equipment to China, according to a report from The Wall Street Journal. “Recent press reports suggest the U.S. Department of Commerce is exploring additional measures to limit Huawei's access to U.S. semiconductor capital equipment (SPE) by requiring chip manufacturing plants globally to procure license... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Feb, 2020 - Comments: 0

Chipmakers and OEMs IC Insights has released its rankings of the 25 largest wafer capacity leaders in terms of monthly installed capacity in 200mm-equivalents as of December 2019. Samsung was in first place, followed by TSMC, Micron, SK Hynix, and Kioxia, formerly Toshiba Memory, according to IC Insights. Combined capacity of the top five companies represented 53% of total global wafer capa... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Oct, 2019 - Comments: 0

Fab tools A consortium of 31 companies have launched a new project, called the “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe.” The program is referred to as APPLAUSE. With a budget of 34 million euros, the project is being coordinated by ICOS, a division of KLA. “APPLAUSE will focus on advanced optics, photonics and electronics packagin... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 May, 2019 - Comments: 0

Packaging and test In the rankings, ASE was the top OSAT in terms of sales in the first quarter of 2019, according to TrendForce. Amkor and JCET were next in the rankings. “Judging from the falling phone sales 1Q19 impacted by the U.S.-China trade dispute and the oversupply situation in memory markets, the total revenue of the top ten businesses in packaging and testing are predicted to st... » read more

The Race To Zero Defects
By Jeff Dorsch - 10 Sep, 2018 - Comments: 1

By Jeff Dorsch and Ed Sperling Testing chips is becoming more difficult, more time-consuming, and much more critical—particularly as these chips end up in cars, industrial automation, and a variety of edge devices. Now the question is how to provide enough test coverage to ensure that chips will work as expected without slowing down the manufacturing process or driving up costs. Balanci... » read more

What’s in a Name?
By Jeff Dorsch - 06 Aug, 2018 - Comments: 0

Test Vision 2020 is a specialty workshop held each year during Semicon West. Formerly known as ATE Vision 2020, the program focuses on automatic test equipment and related topics. This year’s edition heard a lot about artificial intelligence, automotive electronics, and machine learning, which have been the leading topics at every tech conference I’ve attended in 2018. The workshop’s t... » read more

The Best in Test
By Jeff Dorsch - 11 Jun, 2018 - Comments: 0

“The 10 Best Semiconductor Equipment Supplier Rankings for 2018” was recently released by VLSI Research. Teradyne and Advantest placed first and second, respectively, in the large-company rankings, each rating five stars, based on evaluations by customers. Xcerra placed fifth in the focused-company rankings, with four-and-a-half stars. The market research firm also ranked the top vendors... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 May, 2017 - Comments: 0

Chipmakers Samsung has formed a new foundry division and rolled out a range of new processes. Specifically, Samsung plans to develop 8nm, 7nm, 6nm, 5nm and 4nm. It also introduced an 18nm FD-SOI technology. GlobalFoundries has provided more details about its 300mm fab plans in China. The company and the Chengdu municipality have announced an investment to develop an ecosystem for its 22nm ... » read more

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