tag: Forschungszentrum Jülich

Power/Performance Bits: Nov. 2
By Jesse Allen - 02 Nov, 2021 - Comments: 0

GaN CMOS ICs Researchers from the Hong Kong University of Science and Technology (HKUST) are working to increase the functionality available to wide bandgap gallium nitride (GaN) electronics. GaN is frequently used in power electronics, such as power converters and supplies. However, GaN CMOS technology has been hampered by the difficulties in implementing p-channel transistors and integrat... » read more

Manufacturing Bits: April 5
By Mark LaPedus - 05 Apr, 2021 - Comments: 0

Open access superconducting magnets The National High Magnetic Field Laboratory or MagLab has opened the world's strongest superconducting magnet to users. In the works for eight years, the 32 tesla (T) all-superconducting magnet enables scientists to conduct research for various applications, such as quantum matter experiments. The system is called the SCM-32 T. MagLab develops several ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Mar, 2021 - Comments: 0

Tools Synopsys introduced Euclide, a next-generation hardware description language (HDL)-aware integrated development environment (IDE). Euclide aims to enable earlier detection of bugs and optimize code for design and verification flows by identifying complex design and testbench compliance checks during SystemVerilog and UVM development. It assists correct-by-construction code development th... » read more

Power/Performance Bits: May 5
By Jesse Allen - 05 May, 2020 - Comments: 0

CMOS-compatible laser Researchers at Forschungszentrum Jülich, Center for Nanoscience and Nanotechnology (C2N), STMicroelectronics, and CEA-Leti Grenoble developed a CMOS-compatible laser for optical data transfer. Comprised of germanium and tin, the efficiency is comparable with conventional GaAs semiconductor lasers on Si. Optical communications provide much higher data rates, and are be... » read more

Manufacturing Bits: Oct. 22
By Mark LaPedus - 22 Oct, 2019 - Comments: 0

3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

Manufacturing Bits: June 26
By Mark LaPedus - 26 Jun, 2018 - Comments: 0

Gummy bear chips The Technical University of Munich (TUM) and Forschungszentrum Jülich have developed a 3D inkjet printing technique to print electrodes on several soft substrates, including gummy bears. The main application is to develop a new class of sensor-based implants for life sciences. For this application, electrodes or microelectrode arrays (MEAs) are developed and printed on sof... » read more

System Bits: Dec. 20
By Ann Mutschler - 20 Dec, 2016 - Comments: 0

Removing quasiparticles from superconducting quantum circuits improves lifetime Given that an important prerequisite for the realization of high-performance quantum computers is that the stored data should remain intact for as long as possible, an international team of scientists at European interdisciplinary research institute Forschungszentrum Jülich has succeeded in making further improvem... » read more

Power/Performance Bits: Sept. 20
By Jesse Allen - 20 Sep, 2016 - Comments: 0

Energy-harvesting fabric Researchers at the Georgia Institute of Technology and Chongqing University in China developed a fabric that can simultaneously harvest energy from both sunshine and motion. The fabric, just .32mm thick, was constructed using a commercial textile machine to weave together solar cells constructed from lightweight polymer fibers with fiber-based triboelectric nanoge... » read more

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