Week In Review: Design, Low Power

By Jesse Allen - 05 May, 2023 - Comments: 0

Arm advanced its progress toward an initial public offering, confidentially submitting a draft registration statement on Form F-1 to the U.S. Securities and Exchange Commission. The size and price range for the proposed offering have yet to be determined. Graphene IDM Paragraf acquired Cardea Bio, a maker of graphene-based biocompatible chips. Cardea has developed a biosignal processing unit... » read more

Research Bits: Jan. 17

By Jesse Allen - 17 Jan, 2023 - Comments: 0

Ionic circuit for neural nets Researchers at Harvard University and DNA Script developed an ionic circuit comprising hundreds of ionic transistors for neural net computing. While ions in water move slower than electrons in semiconductors, the team noted that the diversity of ionic species with different physical and chemical properties could be harnessed for more diverse information process... » read more

Week In Review: Design, Low Power

By Jesse Allen - 11 Mar, 2022 - Comments: 0

Intellectual Property Flex Logix inked an agreement with the Air Force Research Laboratory, Sensors Directorate (AFRL/RY) covering any Flex Logix IP technology for use in all US Government-funded programs for research and prototyping purposes with no license fees. “Our first license with AFRL for EFLX eFPGA in GlobalFoundries 12nm process was highly successful, with more than a half dozen pr... » read more

Comprehensive Model of Electron Conduction in Oxide-Based Memristive Devices

By Technical Paper Link - 03 Feb, 2022 - Comments: 0

Abstract "Memristive devices are two-terminal devices that can change their resistance state upon application of appropriate voltage stimuli. The resistance can be tuned over a wide resistance range enabling applications such as multibit data storage or analog computing-in-memory concepts. One of the most promising classes of memristive devices is based on the valence change mechanism in oxide... » read more

Week In Review: Design, Low Power

By Jesse Allen - 21 Jan, 2022 - Comments: 0

Tools & design EDA industry revenue increased 7.1% year-over-year from $2.95 billion to $3.46 billion in Q3 2021, according to the ESD Alliance. "Geographically, all regions reported double-digit growth, with product categories CAE, Printed Circuit Board and Multi-Chip Module, SIP, and Services also showing double-digit growth," said Walden C. Rhines, Executive Sponsor of the SEMI Electron... » read more

Power/Performance Bits: Nov. 2

By Jesse Allen - 02 Nov, 2021 - Comments: 0

GaN CMOS ICs Researchers from the Hong Kong University of Science and Technology (HKUST) are working to increase the functionality available to wide bandgap gallium nitride (GaN) electronics. GaN is frequently used in power electronics, such as power converters and supplies. However, GaN CMOS technology has been hampered by the difficulties in implementing p-channel transistors and integrat... » read more

Manufacturing Bits: April 5

By Mark LaPedus - 05 Apr, 2021 - Comments: 0

Open access superconducting magnets The National High Magnetic Field Laboratory or MagLab has opened the world's strongest superconducting magnet to users. In the works for eight years, the 32 tesla (T) all-superconducting magnet enables scientists to conduct research for various applications, such as quantum matter experiments. The system is called the SCM-32 T. MagLab develops several ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 05 Mar, 2021 - Comments: 0

Tools Synopsys introduced Euclide, a next-generation hardware description language (HDL)-aware integrated development environment (IDE). Euclide aims to enable earlier detection of bugs and optimize code for design and verification flows by identifying complex design and testbench compliance checks during SystemVerilog and UVM development. It assists correct-by-construction code development th... » read more

Power/Performance Bits: May 5

By Jesse Allen - 05 May, 2020 - Comments: 0

CMOS-compatible laser Researchers at Forschungszentrum Jülich, Center for Nanoscience and Nanotechnology (C2N), STMicroelectronics, and CEA-Leti Grenoble developed a CMOS-compatible laser for optical data transfer. Comprised of germanium and tin, the efficiency is comparable with conventional GaAs semiconductor lasers on Si. Optical communications provide much higher data rates, and are be... » read more

Manufacturing Bits: Oct. 22

By Mark LaPedus - 22 Oct, 2019 - Comments: 0

3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

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tag: Forschungszentrum Jülich

Week In Review: Design, Low Power

Research Bits: Jan. 17

Week In Review: Design, Low Power

Comprehensive Model of Electron Conduction in Oxide-Based Memristive Devices

Week In Review: Design, Low Power

Power/Performance Bits: Nov. 2

Manufacturing Bits: April 5

Week In Review: Design, Low Power

Power/Performance Bits: May 5

Manufacturing Bits: Oct. 22