Fan-outs are creating a buzz and gaining steam in the market at a pace far beyond what anyone would have expected even at the start of the year.
The approach, which has been around for several years, is a wafer-level packaging process that enables ultra-thin, high-density packages.
So why the buzz? Apple is apparently moving to [getkc id="202" kc_name="fan-out"] packaging, according to an...
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